Solid state diffusion bonding of titanium to steel using a copper base alloy as interlayer

被引:176
作者
Elrefaey, A. [1 ]
Tillmann, W. [1 ]
机构
[1] Dortmund Univ Technol, Fac Mech Engn, Inst Mat Engn, Dortmund, Germany
关键词
Diffusion bonding; Titanium; Steel; Copper interlayer; Microstructure; STAINLESS-STEEL; NI;
D O I
10.1016/j.jmatprotec.2008.06.014
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Dissimilar titanium/steel metals were successfully joined by diffusion bonding process with the help of a copper-based interlayer. The appropriate processing parameters have been investigated and the joints were analyzed by means of scanning electron microscopy (SEM), microhardness measurement, shear strength test, and X-ray diffractometry (XRD). The results show that the joint could not be bonded at a temperature lower than 800 degrees C even at holding time of 180 min. However, at 850 degrees C successful joining was achieved at all holding times. on the other hand, atom diffusion and migration between Ti and Fe or C were effectively prevented by adding a copper-based interlayer and hence, Fe-Ti and Ti-C intermetallics were not formed in the joint. This technique provides a reliable method of bonding titanium to steel. (C) 2008 Elsevier B.V. All rights reserved.
引用
收藏
页码:2746 / 2752
页数:7
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