Low-dielectric-constant materials for ULSI interlayer-dielectric applications

被引：239

作者：

Lee, WW ^{[1
]}

Ho, PS ^{[1
]}

机构：

[1] UNIV TEXAS,LAB INTERCONNECT & PACKAGING,AUSTIN,TX 78712

来源：

关键词：

D O I：

10.1557/S0883769400034151

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：19 / 24

页数：6

共 32 条

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[2]

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[3]

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[4]

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EDELSTEIN, DC ;

SAIHALASZ, GA ;

MII, YJ .

[6]

Fleming J. G., 1997, Advanced Metallization and Interconnect Systems for ULSI Applications in 1996, P471

GRIFFIN, AJ ;

BROTZEN, FR ;

LOOS, PJ .

[8]

HUNTER W, 1995, IEEE INT EL DEV M, V5, P483

[9]

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[10]

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