Strong ties and weak ties of the knowledge spillover network in the semiconductor industry

被引:60
作者
Wang, Chun-Chieh [1 ]
Sung, Hui-Yun [2 ]
Chen, Dar-Zen [3 ,4 ]
Huang, Mu-Hsuan [5 ]
机构
[1] Natl Taiwan Univ, Dept Bioind Commun & Dev, 1,Sec 4,Roosevelt Rd, Taipei 10617, Taiwan
[2] Natl Chung Hsing Univ, Grad Inst Lib & Informat Sci, 250 Kuo Kuang Rd, Taichung 40227, Taiwan
[3] Natl Taiwan Univ, Dept Mech Engn, 1,Sec 4,Roosevelt Rd, Taipei 10617, Taiwan
[4] Natl Taiwan Univ, Inst Ind Engn, 1,Sec 4,Roosevelt Rd, Taipei 10617, Taiwan
[5] Natl Taiwan Univ, Dept Lib & Informat Sci, 1,Sec 4,Roosevelt Rd, Taipei 10617, Taiwan
关键词
Knowledge spillover; Semiconductor industry; R&D cooperation; Patent citation; Strong tie; Weak tie; RESEARCH-AND-DEVELOPMENT; STRATEGIC ALLIANCES; MULTINATIONAL-CORPORATIONS; INTERFIRM NETWORKS; OPEN INNOVATION; FIRMS; PERFORMANCE; BIBLIOMETRICS; EMBEDDEDNESS; COOPERATION;
D O I
10.1016/j.techfore.2017.02.011
中图分类号
F [经济];
学科分类号
02 ;
摘要
This study aims to analyse knowledge spillovers across semiconductor companies through two channels with time evolution. Depending upon the wafer diameters, this study divided the technological development into three periods: 6 in. (1976-1991), 8 in. (1989-1999) and 12 in. (1997-2011). R&D cooperation and patent citations were used to measure the strong ties and weak ties of knowledge spillover networks. Adopting patent bibliometrics and social network analysis, this study examined main companies' network structures and channels of knowledge spillovers. Results showed that semiconductor-related knowledge spilled over more efficiently through weak ties than through strong ties. Furthermore, it was found that strong ties could be used to monitor the development of shared technologies, and weak ties could be used to monitor the development of specific technologies. During the period of the 6-inch wafer diameter, companies that had high degrees of centrality in both strong and weak ties of knowledge spillovers included: Toshiba, Mitsubishi, NEC, Hitachi and National Semi. During the period of the 8-inch wafer diameter, such companies included: STMicroelectronics, Mitsubishi, NEC, TI, Toshiba, Siemens and Philips. During the 12-inch wafer diameter, such companies included: Samsung, Toshiba, NEC and STMicroelectronics. (C) 2017 Elsevier Inc. All rights reserved.
引用
收藏
页码:114 / 127
页数:14
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