Numerical investigation for natural convection of a nanofluid in an inclined L-shaped cavity in the presence of an inclined magnetic field
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作者:
Elshehabey, Hillal M.
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South Valley Univ, Dept Math, Fac Sci, Qena, Egypt
Univ Tecn Lisboa, Inst Super Tecn, Dept Math, Lisbon, PortugalSouth Valley Univ, Dept Math, Fac Sci, Qena, Egypt
Elshehabey, Hillal M.
[1
,2
]
Hady, F. M.
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Assiut Univ, Dept Math, Fac Sci, Assiut, EgyptSouth Valley Univ, Dept Math, Fac Sci, Qena, Egypt
Hady, F. M.
[3
]
Ahmed, Sameh E.
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South Valley Univ, Dept Math, Fac Sci, Qena, EgyptSouth Valley Univ, Dept Math, Fac Sci, Qena, Egypt
Ahmed, Sameh E.
[1
]
Mohamed, R. A.
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South Valley Univ, Dept Math, Fac Sci, Qena, EgyptSouth Valley Univ, Dept Math, Fac Sci, Qena, Egypt
Mohamed, R. A.
[1
]
机构:
[1] South Valley Univ, Dept Math, Fac Sci, Qena, Egypt
[2] Univ Tecn Lisboa, Inst Super Tecn, Dept Math, Lisbon, Portugal
[3] Assiut Univ, Dept Math, Fac Sci, Assiut, Egypt
The problem of natural convection in an inclined L-shaped enclosure filled with Cu/water nanofluid that operates under differentially heated walls in the presence of an inclined magnetic field is presented in this paper. The fully implicit finite difference method is used to solve the governing equations. A comparison with previously published results in special case of the present study is performed and a very good agreement is found. Heat transfer and fluid flow are examined for parameters of the Hartmann number (0 <= Ha <= 100), the nanopartides volume fraction (0% <= phi <= 20%), the cavity inclination angle (0 degrees <= theta <= 300 degrees), the magnetic field inclination angle (0 degrees <= gamma <= 270 degrees), the cavity aspect ratio (0.25 <= AR <= 0.6) and the Rayleigh number (10(3) <= Ra <= 10(6)). It is found that the presence of the magnetic field in the fluid region causes a significant reduction in the fluid flow and heat transfer characteristics. Also, a good enhancement in the heat transfer rate can be obtained by adding the copper nanoparticles to the base fluid. (C) 2014 Elsevier Ltd. All rights reserved.