Wet-etch bulk micromachining of (100) InP substrates

被引:17
作者
Eliás, P
Kostic, I
Soltys, J
Hasenöhrl, S
机构
[1] Slovak Acad Sci, Inst Elect Engn, Bratislava 84101, Slovakia
[2] Slovak Acad Sci, Inst Informat, Bratislava 84507, Slovakia
关键词
D O I
10.1088/0960-1317/14/8/013
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The study focused on object formation in (100) InP by etching in 3HCl:1H(3)PO(4) through convex and concave square mask patterns of varied orientation and size. Their upper right-hand-side corners were aligned to [0 (1) over bar0], and to 15degrees, 30degrees and 45degrees off [0 (1) over bar0] to [0 (1) over bar(1) over bar]. Some [0 (1) over bar(1) over bar]-oriented convex squares had [01 (1) over bar]- and [0 (1) over bar1]-oriented corners compensated with rectangular extensions. The concave patterns led to objects with ordinary slow-etching or etch-stop facets along sides in line within [0 (1) over bar0]-[0 (1) over bar1] and with ordinary and re-entrant facets along sides in line within [00 (1) over bar]-[0 (1) over bar(1) over bar]. The convex patterns ([0 (1) over bar0], 15degrees and 30degrees) led to objects initially confined by fast-etching facets at corners and slow-etching or etch-stop facets at sides (ordinary between [0 (1) over bar0] and [0 (1) over bar1], and re-entrant between [00 (1) over bar] and [0 (1) over bar(1) over bar]). The side facets were eliminated by the progress of the corner ones. They ([0 (1) over bar0]-oriented patterns) proceeded at rates almost independent of size before the eradication of the side facets, after which they proceeded faster. The [0 (1) over bar(1) over bar]-oriented convex patterns led to objects confined only by fast-etching facets. The objects developed at rates that considerably depended on pattern size and etching time. Objects under small patterns developed faster compared to those under large ones. The [0 (1) over bar(1) over bar]-oriented corner-compensated patterns led to pyramidal objects confined by facets related to (110), (1 (1) over bar0), (101) and (10 (1) over bar).
引用
收藏
页码:1205 / 1214
页数:10
相关论文
共 34 条
[1]   CHEMICAL ETCHING CHARACTERISTICS OF (001)INP [J].
ADACHI, S ;
KAWAGUCHI, H .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1981, 128 (06) :1342-1349
[2]   INGAASP INP PLANAR-STRIPE LASERS WITH CHEMICALLY ETCHED MIRRORS [J].
ADACHI, S ;
KAWAGUCHI, H ;
IWANE, G .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1982, 129 (04) :883-886
[3]   Ultrasmooth V-grooves in InP by two-step wet chemical etching [J].
Bonsch, P ;
Wullner, D ;
Schrimpf, T ;
Schlachetzki, A ;
Lacmann, R .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1998, 145 (04) :1273-1276
[4]   Nanofabrication of photonic crystal membrane lasers [J].
Cao, JR ;
Lee, PT ;
Choi, SJ ;
Shafiiha, R ;
Choi, SJ ;
O'Brien, JD ;
Dapkus, PD .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2002, 20 (02) :618-621
[5]   Etching simulation of convex and mixed InP and Si structures [J].
Chahoud, M ;
Wehmann, HH ;
Schlachetzki, A .
SENSORS AND ACTUATORS A-PHYSICAL, 1998, 69 (03) :251-258
[6]   ON THE FORMATION OF PLANAR-ETCHED FACETS IN GAINASP INP DOUBLE HETEROSTRUCTURES [J].
COLDREN, LA ;
FURUYA, K ;
MILLER, BI .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (09) :1918-1926
[7]   Properties of InGaAs/InP thermoelectric and surface bulk micromachined infrared sensors [J].
Dehe, A ;
Hartnagel, HL ;
Pavlidis, D ;
Hong, K ;
Kuphal, E .
APPLIED PHYSICS LETTERS, 1996, 69 (20) :3039-3041
[8]  
Deimel P. P., 1991, Journal of Micromechanics and Microengineering, V1, P199, DOI 10.1088/0960-1317/1/4/002
[9]   SEM and AFM characterisation of high-mesa patterned InP substrates prepared by wet etching [J].
Eliás, P ;
Cambel, V ;
Hasenöhrl, S ;
Hudek, P ;
Novák, J .
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 1999, 66 (1-3) :15-20
[10]  
ELIAS P, UNPUB