Design of Si surfaces for self-assembled nano architecture

被引:18
|
作者
Ogino, T [1 ]
Homma, Y [1 ]
Kobayashi, Y [1 ]
Hibino, H [1 ]
Prabhakaran, K [1 ]
Sumitomo, K [1 ]
Omi, H [1 ]
Suzuki, S [1 ]
Yamashita, T [1 ]
Bottomley, DJ [1 ]
Ling, F [1 ]
Kaneko, A [1 ]
机构
[1] NTT Corp, NTT Basic Res Labs, Atsugi, Kanagawa 2430198, Japan
关键词
silicon; germanium; silicon-germanium; semiconductor semiconductor heterostructures; single crystal surfaces; step formation and bunching; self-assembly; surface stress;
D O I
10.1016/S0039-6028(02)01600-X
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The final goal of nanostructure integration based on self-assembly is full-wafer design of whole atomic-level structures. Toward this goal, we must first be able to control atomic steps, reconstructed domains, surface strain, and atomic species. Atomic steps can be rearranged artificially in a large area using lithographic technique and we are now close to achieving complete control of step positions. Patterns of reconstructed domain regions can be ordered by self-organization. In nanostructure self-assembly, such as the coherently grown Ge quantum nanostructures on Si(0 0 1) and Si(1 1 3) surfaces, strain engineering is important for controlling position, shape, and distribution. Ordered Ge-island chains on Si(0 0 1) show that artificial strain distribution design is a powerful tool for nanostructure integration. Surface composition on SiGe mixed surfaces can be reversibly changed by hydrogen adsorption and desorption. These approaches to designing surface structures show that the bottom-up approach is a promising alternative in semiconductor integration technology. (C) 2002 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:1 / 9
页数:9
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