A new in-situ approach to flip-chip interconnect characterization up to millimeter wave frequencies

被引：2
|
作者：
Pfeiffer, UR [1 ]
Chandrasekhar, A [1 ]
Zwick, T [1 ]
机构：
[1] IBM Corp, Thomas J Watson Res Ctr, Yorktown Hts, NY 10598 USA
来源：
SIGNAL PROPAGATION ON INTERCONNECTS, PROCEEDINGS | 2004年
关键词：
D O I：
10.1109/SPI.2004.1409004
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
In this paper we present the performance of flip-chip interconnects up to 40 GHz based on an alternative non-destructive measurement technique. The presented method unfolds the raw flip-chip interconnect. excluding any launch structures for an actually mounted silicon chip. A preliminary modeling approach for chip-package co-design will be outlined.
引用
收藏
页码：59 / 62
页数：4
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