Effect of bio-scavengers on the curing behavior and bonding properties of melamine-formaldehyde resins

被引:52
|
作者
Kim, Sumin
Kim, Hyun-Joong [1 ]
Kim, Hee-Soo
Lee, Hwa Hyoung
机构
[1] Seoul Natl Univ, Program Environm Mat Sci, Lab Adhes & Biocomposites, Seoul 151921, South Korea
[2] Chungnam Natl Univ, Dept Forest Prod, Taejon 305764, South Korea
关键词
adhesion; bio-scavenger; formaldehyde emission; flooring; dynamic mechanical thermal analysis (DMTA); thermogravimetric analysis (TGA);
D O I
10.1002/mame.200600213
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The effects of bio-scavengers on the formaldehyde emission, bonding strength, curing behavior, and thermal decomposition properties of MF resins for engineered flooring and adhesion for wood were investigated. Four varieties of bio-scavengers, tannin powder, wheat flour, rice husk flour, and charcoal, were added to MF resin at 5 wt.-%. To determine formaldehyde emission and bonding strength, we manufactured engineered floorings. MF-charcoal was most effective in reducing formaldehyde emission because of its porous nature, but its bonding strength was decreased. Tannin powder and wheat flour, which contain more hydroxyl groups, showed higher bonding strength and curing degree than pure MF resin did. Although the hydroxyl groups of the bio-scavengers were effective in reducing formaldehyde emission and improve bonding strength and curing degree, rice husk flour and charcoal behaved like inorganic substances, thereby disturbing the adhesion between MF resin and wood and thus reducing the bonding strength. In thermogravimetric analysis, MF-tannin showed the highest thermal stability in the low-temperature range from 100 to 300 T.
引用
收藏
页码:1027 / 1034
页数:8
相关论文
共 14 条
  • [1] PROPERTIES AND WOOD BONDING CAPACITY OF NANOCLAY-MODIFIED UREA AND MELAMINE FORMALDEHYDE RESINS
    Xian, D.
    Semple, K. E.
    Haghdan, S.
    Smith, G. D.
    WOOD AND FIBER SCIENCE, 2013, 45 (04): : 383 - 395
  • [2] Effect of addition of polyvinyl acetate to melamine-formaldehyde resin on the adhesion and formaldehyde emission in engineered flooring
    Kim, S
    Kim, HJ
    INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2005, 25 (05) : 456 - 461
  • [3] Effect of synthesis parameters of cold-setting melamine-urea-formaldehyde resins on the adhesion in wood bonding
    Kim, Minseok
    Park, Byung-Dae
    Hong, Soon-Il
    JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2021, 35 (21) : 2375 - 2390
  • [4] Curing behavior of soy flour with phenol-formaldehyde and isocyanate resins
    Hand, William G.
    Ashurst, W. Robert
    Via, Brian
    Banerjee, Sujit
    INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2018, 87 : 105 - 108
  • [5] Study on Curing Behavior of Low Molar Ratio Urea-formaldehyde Resins with Different Curing Agents
    Dong Yaohui
    Gao Qiang
    Zhang Yue
    Li Jianzhang
    ADVANCES IN COMPOSITES, PTS 1 AND 2, 2011, 150-151 : 965 - 968
  • [6] Thermal curing behavior of modified urea-formaldehyde resin adhesives with two formaldehyde scavengers and their influence on adhesion performance
    Park, Byung-Dae
    Kang, Eun-Chang
    Park, Jong-Young
    JOURNAL OF APPLIED POLYMER SCIENCE, 2008, 110 (03) : 1573 - 1580
  • [7] Thermogravimetric Analysis and Morphological Behavior of Melamine-Formaldehyde Filled Polyvinyl Acetate-Polyester Nonwoven Fabric Composites
    Kumar, M. N. Satheesh
    Siddaramaiah
    JOURNAL OF APPLIED POLYMER SCIENCE, 2009, 111 (03) : 1165 - 1171
  • [8] Curing Behavior of anionic poly(urethane urea) dispersions crosslinked with partially methylated melamine formaldehyde
    Chiu, Hsien-Tang
    Huang, Yi-Chin
    Chiang, Chih-Hsin
    JOURNAL OF APPLIED POLYMER SCIENCE, 2007, 106 (02) : 849 - 856
  • [9] Thermal analysis study of viscoelastic properties and activation energy of melamine-modified urea-formaldehyde resins
    Kim, Sumin
    Kim, Hyun-Joong
    Kim, Hee-Soo
    Lee, Young-Kyu
    Yang, Han-Seung
    JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2006, 20 (08) : 803 - 816
  • [10] Effects of formaldehyde to urea mole ratio on thermal curing behavior of urea-formaldehyde resin and properties of particleboard
    Park, Byung-Dae
    Kang, Eun Chang
    Park, Jong Yong
    JOURNAL OF APPLIED POLYMER SCIENCE, 2006, 101 (03) : 1787 - 1792