Volume Shrinkage Induced by Interfacial Reaction in Micro-Ni/Sn/Ni Joints

被引：29

作者：

Li, C. C. ^{[1
]}

Chung, C. K. ^{[1
,2
]}

Shih, W. L. ^{[1
]}

Kao, C. R. ^{[1
]}

机构：

[1] Natl Taiwan Univ, Dept Mat Sci & Engn, Taipei 10764, Taiwan

[2] Intel Microelect Asia Ltd, Assembly Test Global Mat, Taipei, Taiwan

来源：

METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE | 2014年 / 45A卷 / 05期

关键词：

Solder Joint; Volume Shrinkage; Height Reduction; Solder Volume; Joint Height;

D O I：

10.1007/s11661-014-2263-8

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Experiments are carried out to measure the volume shrinkage during solid-state reaction in micro-joints for three-dimensional integrated circuit applications. Surface profilometer is employed to measure the volume shrinkage for the reaction between Ni and Sn. The shrinkage is correlated with the microstructural evolution during the reaction. It is found that the volume shrinkage is released through both joint height reduction and void formation. The resulting internal stress and the void formation might post potential reliability issues.

引用

页码：2343 / 2346

页数：4

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