Micro-Transfer-Printing: Heterogeneous Integration of Microscale Semiconductor Devices using Elastomer Stamps

被引:0
作者
Bower, Christopher A. [1 ]
Meitl, Matthew [1 ]
Kneeburg, David [1 ]
机构
[1] X Celeprint Ltd, Cork, Ireland
来源
2014 IEEE SENSORS | 2014年
关键词
Micro-assembly; Micro-Transfer-printing; Semiconductor Devices; Heterogeneous Integration; SILICON;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Micro-transfer-printing is an emerging method to accurately assemble microscale semiconductor devices onto non-native substrates. In micro-transfer-printing an engineered elastomer stamp coupled to a precision motion controller is utilized to pick-up and transfer arrays of microscale devices. A wide range of materials and devices have been micro-transfer-printed, including; Silicon integrated circuits, Gallium Arsenide LEDs, Gallium Arsenide solar cells, Gallium Arsenide lasers and Gallium Nitride LEDs. Devices compatible with micro-transferprinting are very thin (< 10 microns) and small (< 100um lateral dimensions) and are ideally suited for making flexible device formats and are also well-suited for waferlevel heterogeneous integration. Here, we review the stateof-the art in Micro-Transfer-Printing and also present Micro-Transfer-Printing as a cost-effective approach to heterogeneous integration of compound semiconductor sensors.
引用
收藏
页码:2111 / 2113
页数:3
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