Nanofluids for Thermal Performance Improvement in Cooling of Electronic Device

被引：22

作者：

Khaleduzzaman, S. S. ^{[1
]}

Saidur, R. ^{[1
,2
]}

Selvaraj, Jeyraj ^{[2
]}

Mahbubul, I. M. ^{[1
]}

Sohel, M. R. ^{[1
]}

Shahrul, I. M. ^{[1
]}

机构：

[1] Univ Malaya, Dept Mech Engn, Kuala Lumpur 50603, Malaysia

[2] Univ Malaya, Power Energy Dedicated Adv Ctr UMPEDAC, Kuala Lumpur 59990, Malaysia

来源：

NANOSCIENCE, NANOTECHNOLOGY AND NANOENGINEERING | 2014年 / 832卷

关键词：

Nanofluid; Microchannel; Thermal performance; Pumping power; cooling; PRESSURE-DROP CHARACTERISTICS; HEAT-TRANSFER;

D O I：

10.4028/www.scientific.net/AMR.832.218

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Nanofluid is a promising coolant for high-heat dissipation electronics device or system. The effect of nanofluids as thermal performances on a rectangular shape microchannel heat sink (MCHS) is analytically studied. Al2O3, SiC, and CuO nanoparticles dispersing in water were considered for analysis. A steady, laminar, and incompressible flow with constant heat flux was assumed in the channel. Nanofluids with concentrations of 0.5 to 4.0 vol. % were analyzed at two different inlet velocities of 0.5 m/s and 3.0 m/s. The results showed that highest thermal conductivity enhancement was 12.45% by using SiC-water nanofluids. In the case of Al2O3-water and CuO-water nanofluids maximum improvement were 11.98% and 11.36%, respectively for 4.0 vol. % of nanoparticle concentration. Furthermore, nanofluids as a coolant instead of water showed a highest improve of heat flux 8.51% for water-CuO, and 6.44% and 5.60% increase for Al2O3-water and SiC-water, respectively.

引用

页码：218 / +

页数：3

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