A capacitive silicon resonator with a movable electrode structure for gap width reduction

被引：38

作者：

Nguyen Van Toan ^{[1
,2
]}

Toda, Masaya ^{[1
,2
]}

Kawai, Yusuke ^{[1
]}

Ono, Takahito ^{[1
]}

机构：

[1] Tohoku Univ, Grad Sch Engn, Sendai, Miyagi 9808579, Japan

[2] Tohoku Univ, Microsyst Integrat Ctr SIC, Sendai, Miyagi 9808579, Japan

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2014年 / 24卷 / 02期

关键词：

capacitive silicon resonator; movable electrode; low temperature co-fired ceramic; finite element method; ACOUSTIC-WAVE RESONATORS; LOW-IMPEDANCE VHF; MEMS;

D O I：

10.1088/0960-1317/24/2/025006

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents a capacitive silicon resonator with movable electrode structures to reduce the motional resistance for lower insertion loss and lower phase noise, and also increase the tuning frequency range for the compensation of temperature drift of the silicon oscillator. The resonant frequency of the fabricated device with a length of 500 mu m, width of 440 mu m and thickness of 5 mu m is observed at 9.65 MHz, and the quality factor is 49 000. Using an electrostatically drived movable electrode structure, it is shown that the motional resistance is reduced by 200 times, the output signal (insertion loss) is increased by 21 dB and the tuning characteristic of the frequency is also increased by seven times over that of the structures without movable electrodes.

引用

页数：11

共 17 条

[1] MEMS for Integrated Timing and Spectral Processing [J].

Ayazi, Farrokh .

PROCEEDINGS OF THE IEEE 2009 CUSTOM INTEGRATED CIRCUITS CONFERENCE, 2009, :65-72

[2] High-Q HF microelectromechanical filters [J].

Bannon, FD ;

Clark, JR ;

Nguyen, CTC .

IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2000, 35 (04) :512-526

[3] Mechanically corner-coupled square microresonator array for reduced series motional resistance [J].

Demirci, Mustafa U. ;

Nguyen, Clark T. -C. .

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2006, 15 (06) :1419-1436

[4] Design, realization and testing of micro-mechanical resonators in thick-film silicon technology with postprocess electrode-to-resonator gap reduction [J].

Galayko, D ;

Kaiser, A ;

Buchaillot, L ;

Legrand, B ;

Collard, D ;

Combi, C .

JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2003, 13 (01) :134-140

[5] Micromechanical IBARs: Tunable High-Q Resonators for Temperature-Compensated Reference Oscillators [J].

Ho, Gavin K. ;

Sundaresan, Krishnakumar ;

Pourkamali, Siavash ;

Ayazi, Farrokh .

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2010, 19 (03) :503-515

[6]

Hsu WT, 2001, PROC IEEE MICR ELECT, P349, DOI 10.1109/MEMSYS.2001.906550

[7]

Lin YW, 2005, P IEEE INT FREQ CONT, P128

[8] A MEMS stage for 3-axis nanopositioning [J].

Liu, Xinyu ;

Kim, Keekyoung ;

Sun, Yu .

JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2007, 17 (09) :1796-1802

[9] MEMS technology for timing and frequency control [J].

Nguyen, Clark T. -C. .

IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, 2007, 54 (02) :251-270

[10]

Toan NV, 2013, PROC IEEE MICR ELECT, P377, DOI 10.1109/MEMSYS.2013.6474257

← 1 2 →