Design Aspects of 3D Integration of MEMS-based Systems

被引：0
|
作者：
Schneider, Peter [1 ]
Reitz, Sven [1 ]
Stolle, Joern [1 ]
Martin, Roland [1 ]
机构：
[1] Fraunhofer Inst Integrated Circuits, Div Design Automat, Dresden, Saxony, Germany
来源：
DTIP 2009: SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS | 2009年
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D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Due to high integration density the influence of manufacturing technologies on the system behavior has to be considered in the design process of 3D systems. Therefore, information from different physical domains has to be provided to designers. The variety of structures and physical effects requires efficient modeling approaches and simulation algorithms. In the following a modular approach which covers detailed analysis with PDE solvers and more abstract behavioral modeling is described.
引用
收藏
页码：92 / 97
页数：6
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