A diplexer based on transmission lines, implemented in LTCC

被引：13

作者：

Fritz, Martin ^{[1
]}

Wiesbeck, Werner

机构：

[1] Siemens AG, CT PS7, Corp Technol, D-81730 Munich, Germany

[2] Univ Karlsruhe, Inst Hochfrequenztech & Elekt, D-76131 Karlsruhe, Germany

来源：

IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2006年 / 29卷 / 03期

关键词：

circuit synthesis; diplexers; distributed parameter circuits; low-temperature cofired ceramics (LTCC); packaging;

D O I：

10.1109/TADVP.2006.872997

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper presents a diplexer circuit based on transmission lines. In comparison with other diplexer circuits, the implementation of the proposed diplexer can be easily done on single as well as multilayer substrates. An implementation example of the presented circuit will be discussed for a global system for mobile communications/digital cellular system (GSM/DCS) application. The diplexer is implemented in a multilayer substrate, using low-temperature cofired ceramics (LTCC) technology. Finally, the simulation results will be compared with the measurements, and it will be shown that they agree excellently. These results and the results out of a sensitivity and yield analysis confirm the excellent behavior of the proposed circuit.

引用

页码：427 / 432

页数：6

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