Thermal fatigue properties of laminated copper film structure under cyclic temperature stress

Mechanical properties and thermal fatigue behavior of laminated copper film structure was widely concerned. Temperature cycling is used as a qualification test to study the thermal cycle stability or fatigue properties of copper interconnect structure under cyclic temperature stress. FIB cross-section of test structure and SEM observation were performed for in-situ morphology analysis before and after temperature cycling. It was found that copper films surface morphology damaged substantially. Hill and voids were found in these films. Its thermal fatigue properties and failure mechanism was analyzed.