Thermal fatigue properties of laminated copper film structure under cyclic temperature stress

被引：0
|
作者：
Xiao, Qingzhong [1 ]
Lin, Xiaoling [1 ]
机构：
[1] China Elect Prod Reliabil & Environm Testing Res, Sci & Technol Reliabil Phys & Applicat Elect Comp, Guangzhou 510640, Guangdong, Peoples R China
来源：
2012 2ND INTERNATIONAL CONFERENCE ON APPLIED ROBOTICS FOR THE POWER INDUSTRY (CARPI) | 2012年
关键词：
thermal fatigue; copper; cyclic temperature stress;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Mechanical properties and thermal fatigue behavior of laminated copper film structure was widely concerned. Temperature cycling is used as a qualification test to study the thermal cycle stability or fatigue properties of copper interconnect structure under cyclic temperature stress. FIB cross-section of test structure and SEM observation were performed for in-situ morphology analysis before and after temperature cycling. It was found that copper films surface morphology damaged substantially. Hill and voids were found in these films. Its thermal fatigue properties and failure mechanism was analyzed.
引用
收藏
页码：408 / 411
页数：4
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