Recent progress in contact, mobility, and encapsulation engineering of InSe and GaSe

被引:73
作者
Arora, Himani [1 ,2 ,3 ]
Erbe, Artur [1 ]
机构
[1] Helmholtz Zentrum Dresden Rossendorf, Dresden, Germany
[2] Tech Univ Dresden, Fac Phys, Dresden, Germany
[3] Tech Univ Dresden, Ctr Adv Elect Dresden, Dresden, Germany
关键词
2D materials; 2D transistors; electronic properties; gallium selenide; indium selenide; vdW semiconductors; HEXAGONAL BORON-NITRIDE; FIELD-EFFECT TRANSISTORS; HIGH-PERFORMANCE; SINGLE-LAYER; HIGH-QUALITY; BLACK PHOSPHORUS; INDIUM SELENIDE; OPTOELECTRONIC PROPERTIES; 2-DIMENSIONAL MATERIALS; ELECTRONIC-STRUCTURE;
D O I
10.1002/inf2.12160
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The field of two-dimensional (2D) materials has stimulated considerable interest in the scientific community. Owing to quantum confinement in one direction, intriguing properties have been reported in 2D materials that cannot be observed in their bulk form. The advent of semiconducting 2D materials with a broad range of electronic properties has provided fascinating opportunities to design and configure next-generation electronics. One such emerging class is the family of III-VI monochalcogenides, the two prominent members of which are indium selenide (InSe) and gallium selenide (GaSe). In contrast to transition metal dichalcogenides, their high intrinsic mobility and the availability of a direct bandgap at small thicknesses have attracted researchers to investigate the underlying physical phenomena as well as their technological applications. However, the sensitivity of InSe and GaSe to environmental influences has limited their exploitation in functional devices. The lack of methods for their scalable synthesis further hinders the realization of their devices. This review article outlines recent advancements in the synthesis and understanding of the charge transport properties of InSe and GaSe for their integration into technological applications. A detailed summary of the improvements in the device structure by optimizing extrinsic factors such as bottom substrates, metal contacts, and device fabrication schemes is provided. Furthermore, various encapsulation techniques that have been proven effective in preventing the degradation of InSe and GaSe layers under ambient conditions are thoroughly discussed. Finally, this article presents an outlook on future research ventures with respect to ongoing developments and practical viability of these materials.
引用
收藏
页码:662 / 693
页数:32
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