A study of thermo-mechanical reliability of lead-free PTH solder joints

被引：7
|
作者：
Nguyen, Jennifer [1 ]
Geiger, David [1 ]
Rooney, Dan [1 ]
Shangguan, Dongkai [1 ]
机构：
[1] Flextronics Int, San Jose, CA USA
来源：
SOLDERING & SURFACE MOUNT TECHNOLOGY | 2009年 / 21卷 / 02期
关键词：
Lead; Soldering; Joining processes; Waves;
D O I：
10.1108/09540910910947462
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Purpose - The purpose of this paper is to consider PTH solder joint reliability, particularly on the PTH solder joints with partial hole-fill and without pin protrusion. Also, the impact of voiding on the solder joint reliability is discussed. Design/methodology/approach - Thermal cycling tests for samples of different hole-fill percentages and voiding were conducted, and cross-sections of the PTH solder joints were performed to evaluate the solder microstructure, intermetallic formation, via hole-fill, and the condition of the PTH metallization and PCB dielectric prior to thermal cycling and at different times during thermal cycling. Findings - Different failure mechanisms were observed for solder joints with and without pin protrusion. PTH components with pin protrusion had better through hole-fill and less voids than PTH components without pin protrusion. Originality/value - The paper discusses in detail the effect of hole-fill percentage and voiding on PTH solder joint reliability.
引用
收藏
页码：39 / 47
页数：9
相关论文
共 50 条
  • [1] Reliability of solder joints assembled with lead-free solder
    Ochiai, Masayuki
    Akamatsu, Toshiya
    Ueda, Hidefumi
    2002, Fujitsu Ltd (38):
  • [2] Reliability of solder joints assembled with lead-free solder
    Ochiai, M
    Akamatsu, T
    Ueda, H
    FUJITSU SCIENTIFIC & TECHNICAL JOURNAL, 2002, 38 (01): : 96 - 101
  • [3] Thermo-mechanical Damage Accumulation during Power Cycling of Lead-Free Surface Mount Solder Joints
    Hegde, Pradeep
    Whalley, David C.
    Silberschmidt, Vadim V.
    ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2008, : 1081 - 1089
  • [4] Reliability Testing of Lead-Free Solder Joints
    Bazu, Marius
    Ilian, Virgil Emil
    Galateanu, Lucian
    Varsescu, Dragos
    Pietrikova, Alena
    2012 35TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE 2012): POWER ELECTRONICS, 2012, : 173 - 177
  • [5] Microstructural Analysis of Lead-free Solder Joint under Thermo-mechanical Loading
    Hung, Kuo-Kang
    Wu, Mei-Ling
    14TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2012), 2012,
  • [6] A study on μBGA solder joints reliability using lead-free solder materials
    Shin, YE
    Lee, JH
    Koh, YW
    Lee, CW
    Yun, JH
    Jung, SB
    KSME INTERNATIONAL JOURNAL, 2002, 16 (07): : 919 - 926
  • [7] A study on μBGA solder joints reliability using lead-free solder materials
    Young-Eui Shin
    Jun Hwan Lee
    Young-Wook Koh
    Chong-Won Lee
    Jun Ho Yun
    Seung-Boo Jung
    KSME International Journal, 2002, 16 : 919 - 926
  • [8] The Effect of Variations in Temperature Cycling Profile and Mechanical Properties of Solder on Thermo-mechanical Reliability of a Lead-free BGA Package
    Belov, Ilja
    Arwidson, Jonas
    Poder, Ralf
    Johannesson, Par
    Leisner, Peter
    2015 16TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2015,
  • [9] Effect of Voids on Thermo-Mechanical Reliability of QFN Solder Joints
    Lall, Pradeep
    Kothari, Nakul
    PROCEEDINGS OF THE NINETEENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2020), 2020, : 1255 - 1263
  • [10] Effects of voids on thermal-mechanical reliability of lead-free solder joints
    Benabou, Lahouari
    Van Nhat Le
    Sun, Zhidan
    Pougnet, Philippe
    Etgens, Victor
    FDMD II - JIP 2014 - FATIGUE DESIGN & MATERIAL DEFECTS, 2014, 12
12345