Solvent-dependent ultrasonic surface treatment on morphological reconstruction of CuO particles for copper electrodeposition

被引：19

作者：

Chen, Yuanming ^{[1
,2
,3
]}

Yan, Dan ^{[1
,2
]}

Jin, Xiaofeng ^{[4
,5
]}

Zeng, Yi ^{[1
,2
]}

Zhang, Dongming ^{[1
,2
]}

Liu, Zhe ^{[6
]}

He, Wei ^{[1
,2
]}

Wang, Shouxu ^{[1
,2
]}

Wang, Zhi ^{[3
]}

Liu, Yaqing ^{[3
]}

Zhang, Weihua ^{[7
]}

Huang, Yunzhong ^{[1
,2
,8
]}

机构：

[1] Univ Elect Sci & Technol China, Sch Mat & Energy, Chengdu 610054, Sichuan, Peoples R China

[2] Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China

[3] North Univ China, Shanxi Prov Key Lab Funct Nanocomposites, Taiyuan 030051, Shanxi, Peoples R China

[4] Natl Ctr Qual Supervis & Testing Printed Circuit, Tongling 244000, Peoples R China

[5] Natl Ctr Qual Supervis & Testing Copper Lead Zinc, Tongling 244000, Peoples R China

[6] Zhongxing Telecommun Equipment Co Ltd, Shengzhen 518057, Peoples R China

[7] Zhuhai Founder Sci Tech High Dens Elect Co Ltd, Zhuhai 519175, Peoples R China

[8] Chongqing Founder High Dens Elect Co Ltd, Chongqing 400030, Peoples R China

来源：

APPLIED SURFACE SCIENCE | 2019年 / 491卷

基金：

中国国家自然科学基金;

关键词：

Copper oxide; Ultrasonic treatment; Solvent polarity; Morphological reconstruction; Copper electrodeposition; OXIDE NANOPARTICLES; SIZE; FABRICATION; DISPERSION; NANOSTRUCTURES; SEDIMENTATION; NANOSHEETS; NANOTUBES; GROWTH;

D O I：

10.1016/j.apsusc.2019.06.117

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Copper oxide (CuO) particles with loose agglomeration of porous flakes were treated by ultrasound in different solvents. CuO particles with completely discrete flakes were obtained with ultrasonic surface treatment in ethyl alcohol as a polar solvent while CuO particles with compacted flake agglomeration were found after ultrasonic treatment in diethyl ether as a non-polar solvent. CuO particles after ultrasonic treatment were characterized to investigate the effects of morphological appearance on size distribution, sedimentation velocity, specific surface area, ultraviolet-visible (UV-vis) absorption spectra, diffraction angle of X-ray diffraction (XRD) pattern, binding energy of X-ray photoelectron spectroscopy (XPS), Raman intensity and dissolution rate. CuO particles with completely discrete flakes exhibited a fastest dissolution rate of 7 s in 12.5 vol% H2SO4 for rapid complement of cupric ions so that the electrolyte for copper electrodepositon could meet the requirement of stable concentration of cupric ions to generate fine copper deposits in a plating system with insoluble anode.

引用

页码：206 / 215

页数：10

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