Change of the trap energy levels of the atomic layer deposited HfLaOx films with different La concentration

被引:26
作者
An, Chee-Hong [1 ]
Lee, Myung Soo [1 ]
Choi, Ju-Yun [1 ]
Kim, Hyoungsub [1 ]
机构
[1] Sungkyunkwan Univ, Sch Adv Mat Sci & Engn, Suwon 440746, South Korea
关键词
atomic layer deposition; hafnium compounds; high-k dielectric thin films; leakage currents; Poole-Frenkel effect; ELECTRICAL-PROPERTIES; GATE; DIELECTRICS; HFO2;
D O I
10.1063/1.3159625
中图分类号
O59 [应用物理学];
学科分类号
摘要
Ultrathin HfO2 and HfLaOx films with La/(Hf+La) ratios of 42%, 57%, and 64% were synthesized with an atomic layer deposition process. By measuring the leakage current at different temperatures, the conduction mechanism of HfO2 and HfLaOx films was shown to follow the Poole-Frenkel emission model under a gate injection condition. Based on the temperature and field-dependence measurements, the intrinsic trap energy levels were found to be 1.42, 1.34, 1.03, and 0.98 eV for the HfLaOx samples with La/(Hf+La) ratios of 0%, 42%, 57%, and 64%, respectively, showing a decreasing behavior as the La content increased.
引用
收藏
页数:3
相关论文
共 17 条
[1]  
Alshareef H.N., 2006, S VLSI TECHNOLOGY, P7, DOI DOI 10.1109/VLSIT.2006.1705190
[2]   Electrical conduction mechanisms of metal/La2O3/Si structure -: art. no. 103503 [J].
Chiu, FC ;
Chou, HW ;
Lee, JYM .
JOURNAL OF APPLIED PHYSICS, 2005, 97 (10)
[3]  
DING SJ, 2008, APPL PHYS LETT, V93
[4]   Fermi-level pinning at the polysilicon/metal oxide interface - Part I [J].
Hobbs, CC ;
Fonseca, LRC ;
Knizhnik, A ;
Dhandapani, V ;
Samavedam, SB ;
Taylor, WJ ;
Grant, JM ;
Dip, LG ;
Triyoso, DH ;
Hegde, RI ;
Gilmer, DC ;
Garcia, R ;
Roan, D ;
Lovejoy, ML ;
Rai, RS ;
Hebert, EA ;
Tseng, HH ;
Anderson, SGH ;
White, BE ;
Tobin, PJ .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2004, 51 (06) :971-977
[5]   Dielectric constant dispersion of yttrium-doped (Ba,Sr)TiO3 films in the high-frequency (10 kHz-67 GHz) domain -: art. no. 232903 [J].
Jeong, DS ;
Hwang, CS ;
Baniecki, JD ;
Shioga, T ;
Kurihara, K ;
Kamehara, N ;
Ishii, M .
APPLIED PHYSICS LETTERS, 2005, 87 (23) :1-3
[6]   Effects of crystallization on the electrical properties of ultrathin HfO2 dielectrics grown by atomic layer deposition [J].
Kim, H ;
McIntyre, PC ;
Saraswat, KC .
APPLIED PHYSICS LETTERS, 2003, 82 (01) :106-108
[7]   Passivation of oxygen vacancy states and suppression of Fermi pinning in HfO2 by La addition [J].
Liu, D. ;
Robertson, J. .
APPLIED PHYSICS LETTERS, 2009, 94 (04)
[8]  
Natarajan S, 2008, INT EL DEVICES MEET, P941
[9]  
Sze S.M., 2013, SEMICONDUCTOR DEVICE
[10]   Application of HfSiON as a gate dielectric material [J].
Visokay, MR ;
Chambers, JJ ;
Rotondaro, ALP ;
Shanware, A ;
Colombo, L .
APPLIED PHYSICS LETTERS, 2002, 80 (17) :3183-3185