An Internally Heated Shape Memory Polymer Dry Adhesive

A conductive epoxy-based shape memory polymer (SMP) is demonstrated using carbon black (CB) as a dopant for the purpose of creating an SMP dry adhesive system which can internally generate the heat required for activation. The electrical and mechanical properties of the CB/SMP blends for varying dopant concentrations are characterized. A composite adhesive is created to minimize surface contact resistance to conductive tape acting as electrodes, while maintaining bulk resistivity required for heat generation due to current flow. The final adhesive can function on flat or curved surfaces. As a demonstration, a 25 mm wide by 45 mm long dry adhesive strip is shown to heat evenly from an applied voltage, and can easily hold a mass in excess of 6 kg when bonded to a spherical concave glass surface using light pressure at 75 degrees C.