Integrated polysilicon and DRIE bulk silicon micromachining for an electrostatic torsional actuator

被引:90
作者
Yeh, JLA [1 ]
Jiang, HR [1 ]
Tien, NC [1 ]
机构
[1] Cornell Univ, Ithaca, NY 14853 USA
关键词
asymmetric combdrive; electrostatic torsional actuator; integrated polysilicon and deep reactive ion etching (DRIE) bulk silicon micromachining; levitation; parallel-plate actuator;
D O I
10.1109/84.809061
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents a fabrication process that integrates polysilicon surface micromachining and deep reactive ion etching (DRIE) bulk silicon micromachining. The process takes advantage of the design flexibility of polysilicon surface micromachining and the deep silicon structures possible with DRIE, As a demonstration, a torsional actuator driven by a combdrive moving in the out-of-plane direction, consisting of polysilicon fingers and bulk silicon fingers, has been fabricated. The integrated process allows the combdrive to be integrated with any structure made by polysilicon surface micromachining, [433].
引用
收藏
页码:456 / 465
页数:10
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