UV/ozone treatment for adhesion improvement of copper/epoxy interface

被引：25

作者：

Bok, Shingyu ^{[1
]}

Lim, Guh-Hwan ^{[1
]}

Lim, Byungkwon ^{[1
]}

机构：

[1] Sungkyunkwan Univ SKKU, Sch Adv Mat Sci & Engn, Suwon 16419, South Korea

来源：

JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY | 2017年 / 46卷

关键词：

Adhesion; UV/ozone; Copper; Epoxy; Silane coupling agent; DEPOSITED COPPER; SURFACE; FILMS; FOIL;

D O I：

10.1016/j.jiec.2016.10.031

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

We developed a simple and efficient method for adhesion improvement of Cu/epoxy interface by utilizing UV/ozone treatment for surface oxidation of Cu substrates. X-ray photoelectron spectroscopy analysis revealed that metallic Cu surface was directly oxidized to CuO and Cu(OH)(2) by UV/ozone treatment. The adhesion of a UV/ozone-treated and then silane-coated Cu substrate to a molded epoxy layer was greatly improved compared to that of a bare Cu substrate. Using this approach, we obtained the peel strength as high as 0.46 kgf/cm from a low-roughness Cu substrate with Rq of similar to 0.1 mu m. (C) 2016 The Korean Society of Industrial and Engineering Chemistry. Published by Elsevier B.V. All rights reserved.

引用

页码：199 / 202

页数：4

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