Temperature Dependence of Photoluminescence Spectra from Crystalline Silicon

被引:32
作者
Yoo, Woo Sik [1 ]
Kang, Kitaek [1 ]
Murai, Gota [2 ]
Yoshimoto, Masahiro [2 ]
机构
[1] WaferMasters Inc, San Jose, CA 95112 USA
[2] Kyoto Inst Technol, Sakyo Ku, Kyoto 6068585, Japan
关键词
PLASMA-ETCHING DAMAGE; RAMAN-SPECTROSCOPY; MULTIWAVELENGTH RAMAN; INTERFACE QUALITY; SI; JUNCTIONS; WAFERS; SEMICONDUCTORS; VISUALIZATION; LUMINESCENCE;
D O I
10.1149/2.0251512jss
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Photoluminescence (PL) spectra from lightly boron (B) doped p(-)-Si(100) under 488.0 nm Ar+ ion laser excitation over the temperature range of 22 K-290 K is presented. Change of PL peak height (maximum intensity), peak position, peak area (areal intensity), full-width-at-half-maximum (FWHM: peak width) were determined as a function of temperature. PL intensity was sharply decreased with temperature increase in the temperature range of 22 K - 170 K and then slowly increased again in the temperature range of 170 K-290 K. Phonon replicas of a relatively sharp band-to-band (or band edge (BE)) PL peak were clearly measured at low temperatures (<= 90 K). PL spectra became broader and the phonon replicas were barely distinguishable as the temperature was increased. The envelope of the main PL peak and the broadening of peak width with the Si temperature were qualitatively in good agreement with the Maxell-Boltzmann probability distribution function. The direction of peak position shift with Si temperature change was also in good agreement with the temperature dependence of the Si bandgap. All measured PL spectra were curve fitted using combinations of modified Gaussian function(s) and standard Gaussian function(s). A simplified curve fitting method for broad PL spectra, consisting of the BE peak and band tail peak, using an exponentially modified Gaussian (EMG or ExGaussian) function and a number of standard Gaussian functions, was proposed from a practical usage point of view. Radiative recombination processes in Si and potential industrial applications of the PL characterization technique were discussed. (C) The Author(s) 2015. Published by ECS.
引用
收藏
页码:P456 / P461
页数:6
相关论文
共 34 条
[1]  
[Anonymous], 2006, Semiconductor Material and Device Characterization, DOI DOI 10.1002/0471749095
[2]  
[Anonymous], 1975, Optical processes in semiconductors
[3]   Epitaxial silicon minority carrier diffusion length by photoluminescence [J].
Baek, D. H. ;
Kim, S. B. ;
Schroder, D. K. .
JOURNAL OF APPLIED PHYSICS, 2008, 104 (05)
[4]   Fast, high resolution, inline contactless electrical semiconductor characterization for photovoltaic applications by microwave detected photoconductivity [J].
Dornich, K. ;
Schueler, N. ;
Berger, B. ;
Niklas, J. R. .
MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS, 2013, 178 (09) :676-681
[5]  
Hemenway C. L., 1962, PHYS ELECT
[6]  
Ibuka S., 2001, MRS P, V681
[7]   Visualization of Plasma Etching Damage of Si Using Room Temperature Spectroscopic Photoluminescence [J].
Jian, Shiu-Ko Jang ;
Jeng, Chih-Cherng ;
Wang, Ting-Chun ;
Huang, Chih-Mu ;
Wang, Ying-Lang ;
Yoo, Woo Sik .
SILICON COMPATIBLE MATERIALS, PROCESSES, AND TECHNOLOGIES FOR ADVANCED INTEGRATED CIRCUITS AND EMERGING APPLICATIONS 3, 2013, 53 (03) :167-176
[8]   Visualization of Plasma Etching Damage of Si Using Room Temperature Photoluminescence and Raman Spectroscopy [J].
Jian, Shiu-Ko Jang ;
Jeng, Chih-Cherng ;
Wang, Ting-Chun ;
Huang, Chih-Mu ;
Wang, Ying-Lang ;
Yoo, Woo Sik .
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2013, 2 (05) :P214-P224
[9]   Characterization of interface quality between various low-temperature oxides and Si using room-temperature-photoluminescence and Raman spectroscopy [J].
Jian, Shiu-Ko Jang ;
Jeng, Chih-Cherng ;
Wang, Ting-Chun ;
Huang, Chih-Mu ;
Wang, Ying-Lang ;
Yoo, Woo Sik .
JOURNAL OF MATERIALS RESEARCH, 2013, 28 (09) :1269-1277
[10]   Monitoring metal contamination of silicon by multiwavelength room temperature photoluminescence spectroscopy [J].
Jian, Shiu-Ko Jang ;
Jeng, Chih-Cherng ;
Yoo, Woo Sik .
AIP ADVANCES, 2012, 2 (04)