共 50 条
- [43] Thermal analysis of high power LED light PROCEEDINGS OF THE 2015 INTERNATIONAL INDUSTRIAL INFORMATICS AND COMPUTER ENGINEERING CONFERENCE, 2015, : 2160 - 2163
- [44] Joint structure in high brightness light emitting diode (HB LED) packages MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2006, 441 (1-2): : 357 - 361
- [45] The Effects of Si Submounts Containing Cu Thermal Vias on the Heat-Dissipation Characteristics of a High-Power Light-Emitting Diode Package Journal of Electronic Materials, 2014, 43 : 630 - 635
- [48] Failure Analysis Techniques for High Power Light Emitting Diodes 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 983 - 986
- [49] Effect of chip spacing on light extraction for light-emitting diode array OPTICS EXPRESS, 2015, 23 (11): : A640 - A649