High Gain 1.3-μm GaInNAs SOA with Fast Gain Dynamics and Enhanced Temperature Stability

被引:2
|
作者
Fitsios, D. [1 ,2 ]
Giannoulis, G. [3 ]
Iliadis, N. [3 ]
Korpijarvi, V. -M. [4 ]
Viheriala, J. [4 ]
Laakso, A. [4 ]
Dris, S. [3 ]
Spyropoulou, M. [3 ]
Avramopoulos, H. [3 ]
Kanellos, G. T. [1 ]
Pleros, N. [1 ,2 ]
Guina, M. [4 ]
机构
[1] Informat Technol Inst, Ctr Res & Technol Hellas, Thessaloniki 57001, Greece
[2] Aristotle Univ Thessaloniki, Dept Informat, Thessaloniki 54124, Greece
[3] Natl Tech Univ Athens, School Elect & Comp Engn, Athens, Greece
[4] Tampere Univ Technol, Optoelectron Res Ctr ORC, Tampere, Finland
来源
OPTICAL COMPONENTS AND MATERIALS XI | 2014年 / 8982卷
关键词
Semiconductor Optical Amplifier (SOA); Dilute Nitrides; Temperature Stability; Optical Signal Processing; Uncooled Operation; Fast Gain Recovery;
D O I
10.1117/12.2037904
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Semiconductor optical amplifiers (SOAs) are a well-established solution of optical access networks. They could prove an enabling technology for DataCom by offering extended range of active optical functionalities. However, in such cost-and energy-critical applications, high-integration densities increase the operational temperatures and require power-hungry external cooling. Taking a step further towards improving the cost and energy effectiveness of active optical components, we report on the development of a GaInNAs/GaAs (dilute nitride) SOA operating at 1.3 mu m that exhibits a gain value of 28 dB and combined with excellent temperature stability owing to the large conduction band offset between GaInNAs quantum well and GaAs barrier. Moreover, the characterization results reveal almost no gain variation around the 1320 nm region for a temperature range from 20 degrees to 50 degrees C. The gain recovery time attained values as short as 100 ps, allowing implementation of various signal processing functionalities at 10 Gb/s. The combined parameters are very attractive for application in photonic integrated circuits requiring uncooled operation and thus minimizing power consumption. Moreover, as a result of the insensitivity to heating issues, a higher number of active elements can be integrated on chip-scale circuitry, allowing for higher integration densities and more complex optical on-chip functions. Such component could prove essential for next generation DataCom networks.
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页数:6
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