Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board under wet H2S environment

被引：62

作者：

Zou, Shiwen ^{[1
]}

Li, Xiaogang ^{[1
]}

Dong, Chaofang ^{[1
]}

Ding, Kangkang ^{[1
]}

Xiao, Kui ^{[1
]}

机构：

[1] Univ Sci & Technol Beijing, Ctr Corros & Protect, Beijing 100083, Peoples R China

来源：

ELECTROCHIMICA ACTA | 2013年 / 114卷

基金：

中国国家自然科学基金;

关键词：

PCB; H2S; Electrochemical migration; Whisker formation; THIN ELECTROLYTE LAYER; ATMOSPHERIC CORROSION; RAMAN-SPECTRA; OXALIC-ACID; COPPER; PBS; SNO2; MICROCIRCUITS; NANOPARTICLES; SPECTROSCOPY;

D O I：

10.1016/j.electacta.2013.10.051

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board (PCB) under wet H2S environment were analyzed by environment scanning electron microscope (ESEM), Energy dispersive X-ray spectroscopy (EDS) with mapping and element phase cluster (EPC) techniques, Raman Spectrum analysis and electrochemical impedance spectroscopy (EIS) technology. The results showed that nonuniform corrosion behavior occurred on PCB surfaces under.1 ppm wet H2S at 40 degrees C; whiskers formed on the inner sidewall of via-holes with a growth rate of 1.2 angstrom/s; numerous corrosion products migrated through the pore of plated gold layer, which broke off the protective layer. The corrosion rate was accelerated according to the big-cathode-small-anode model. (C) 2013 Elsevier Ltd. All rights reserved.

引用

页码：363 / 371

页数：9

共 42 条

[1] Corrosion investigation of material combinations in a mobile phone dome-key pad system [J].

Ambat, Rajan ;

Moller, Per .

CORROSION SCIENCE, 2007, 49 (07) :2866-2879

[2]

BECCARIA AM, 1982, WERKST KORROS, V33, P416

[3] Electrochemistry on microcircuits. I: Copper microelectrodes in oxalic acid media [J].

Gabrielli, C. ;

Beitone, L. ;

Mace, C. ;

Ostermann, E. ;

Perrot, H. .

MICROELECTRONIC ENGINEERING, 2008, 85 (08) :1677-1685

[4] Electrochemistry on microcircuits. II: Copper dendrites in oxalic acid [J].

Gabrielli, C. ;

Beitone, L. ;

Mace, C. ;

Ostermann, E. ;

Perrot, H. .

MICROELECTRONIC ENGINEERING, 2008, 85 (08) :1686-1698

[5] Effect of Ag on oxidation of Cu-base leadframe [J].

Gen, Wenyan ;

Chen, Xi ;

Hu, Anmin ;

Li, Ming .

MICROELECTRONICS RELIABILITY, 2011, 51 (04) :866-870

[6] Indoor atmospheric corrosion of electronic materials in tropical-mountain environments [J].

Gil, H. ;

Calderon, J. A. ;

Buitrago, C. P. ;

Echavarria, A. ;

Echeverria, F. .

CORROSION SCIENCE, 2010, 52 (02) :327-337

[7]

Guttenplan J.D., 1978, MATER PERFORMANCE, V18, P49

[8] Corrosion behavior, whisker growth, and electrochemical migration of Sn-3.0Ag-0.5Cu solder doping with In and Zn in NaCl solution [J].

Hua, L. ;

Yang, C. .

MICROELECTRONICS RELIABILITY, 2011, 51 (12) :2274-2283

[9] Effect of direct current electric field on atmospheric corrosion behavior of copper under thin electrolyte layer [J].

Huang, Hualiang ;

Guo, Xingpeng ;

Zhang, Guoan ;

Dong, Zehua .

CORROSION SCIENCE, 2011, 53 (10) :3446-3449

[10] The effects of Cl- ion concentration and relative humidity on atmospheric corrosion behaviour of PCB-Cu under adsorbed thin electrolyte layer [J].

Huang, Hualiang ;

Dong, Zehua ;

Chen, Zhenyu ;

Guo, Xingpeng .

CORROSION SCIENCE, 2011, 53 (04) :1230-1236

← 1 2 3 4 5 →