Enhanced immunity against crosstalk and EMI using GHz twisted differential line structure on PCB

被引：0

作者：

Kam, DG ^{[1
]}

Lee, H ^{[1
]}

Baek, S ^{[1
]}

Park, B ^{[1
]}

Kim, J ^{[1
]}

机构：

[1] Korea Adv Inst Sci & Technol, Div EE, Dept EECS, Taejon, South Korea

来源：

2002 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1 AND 2, SYMPOSIUM RECORD | 2002年

关键词：

Twisted Differential Line (TDL); offset; vertical; twisted pair; enhanced immunity; crosstalk; and radiated emission;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

There is a growing tendency to adopt a differential signaling scheme for critical signals. To support differential signaling, differential transmission lines are required. The concept of twisted pair on the cable interconnection can be readily applied to differential transmission lines on printed circuit boards (PCBs), which enables enhanced immunity against crosstalk and radiated emission. Recently, the new differential transmission line called twisted differential line (TDL) has been introduced In this paper, the enhanced immunity of TDL against crosstalk and radiated emission is clearly demonstrated with both simulation and measurement. TDL is compared with other differential transmission lines showing its superiority. Moreover several ideas to improve the porformance of TDL are proposed and verified to be useful. Offset-TDL (O-TDL) improves crosstalk immunity further and vertical-TDL (V-TDL) enables reduced routing area while maintaining performance.

引用

页码：643 / 647

页数：5

共 4 条

[1]

Araneo R, 2001, 2001 IEEE EMC INTERNATIONAL SYMPOSIUM, VOLS 1 AND 2, P933, DOI 10.1109/ISEMC.2001.950512

[2] COMBINED DIFFERENTIAL AND COMMON-MODE SCATTERING PARAMETERS - THEORY AND SIMULATION [J].

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[3]

KAM DG, 2002, IEEE EL COMP TECHN C

[4] Design and verification of differential transmission lines [J].

Wu, H ;

Beyene, WT ;

Cheng, N ;

Huang, CC ;

Yuan, C .

ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2001, :85-88

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