Bandwidth extension in CMOS with optimized on-chip inductors

被引:282
作者
Mohan, SS [1 ]
Hershenson, MD [1 ]
Boyd, SP [1 ]
Lee, TH [1 ]
机构
[1] Stanford Univ, Dept Elect Engn, Stanford, CA 94305 USA
关键词
CMOS analog integrated circuits; inductors; integrated circuit design; integrated circuit modeling;
D O I
10.1109/4.826816
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We present a technique for enhancing the bandwidth of gigahertz broad-band circuitry! by using optimized on chip spiral inductors as shunt-peaking elements. The series resistance of the on-chip inductor is incorporated as part of the load resistance to permit a large inductance to be realized with minimum area and capacitance, Simple, accurate inductance expressions are used in a lumped circuit inductor model to allow the passive and active components in the circuit to be simultaneously optimized. A quick and efficient global optimization method, based on geometric programming, is discussed. The bandwidth extension technique is applied in the implementation of a 2.125-Gbaud preamplifier that employs a common-gate input stage followed by a cascoded common-source stage. On-chip shunt peaking is introduced at the dominant pole to improve the overall system performance, including a JOB increase in the transimpedance. This implementation achieves a 1.6-k Omega transimpedance and a 0.6-mu A input-referred current noise, while operating with a photodiode capacitance of 0.6 pF. A fully differential topology ensures good substrate and supply noise immunity, The amplifier, implemented in a triple-metal, single-poly, 14-GHz f(Tmax), 0.5-mu m CMOS process, dissipates 225 mW of which 110 mW is consumed by the 50-Omega output driver stage. The optimized on-chip inductors consume only 15% of the total area of 0.6 mm(2).
引用
收藏
页码:346 / 355
页数:10
相关论文
共 26 条
[1]   ON THE CHOICE OF OPTIMUM FET SIZE IN WIDEBAND TRANSIMPEDANCE AMPLIFIERS [J].
ABIDI, AA .
JOURNAL OF LIGHTWAVE TECHNOLOGY, 1988, 6 (01) :64-66
[2]   High Q inductors for wireless applications in a complementary silicon bipolar process [J].
Ashby, KB ;
Koullias, IA ;
Finley, WC ;
Bastek, JJ ;
Moinian, S .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1996, 31 (01) :4-9
[3]  
BOYD S, 1997, INTRO CONVEX OPTIMIZ
[4]  
BOYD SP, 1997, COURSE READER EE364
[5]   Multilevel-spiral inductors using VLSI interconnect technology [J].
Burghartz, JN ;
Jenkins, KA ;
Soyuer, M .
IEEE ELECTRON DEVICE LETTERS, 1996, 17 (09) :428-430
[6]  
CROIS J, 1996, S VLSI CIRC, P28
[7]  
del Mar Hershenson M., 1999, Proceedings 1999 Design Automation Conference (Cat. No. 99CH36361), P994, DOI 10.1109/DAC.1999.782241
[8]  
Duffin R.J., 1967, Geometric Programming-Theory and Applications, VQA264
[9]   DESIGN OF PLANAR RECTANGULAR MICROELECTRONIC INDUCTORS [J].
GREENHOUSE, HM .
IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1974, PH10 (02) :101-109
[10]  
HERSHENSON M, 1999, P IEEE ACM INT C COM