Systematic Lumped-Element Modeling of Differential IC Transmission Lines

被引：3

作者：

Tiemeijer, Luuk F. ^{[1
]}

Pijper, Ralf M. T. ^{[1
]}

van Steenwijk, J. Anne ^{[1
]}

van Noort, Wibo ^{[2
]}

机构：

[1] NXP Semicond Taiwan Semicond Mfg Co, Res Ctr, NL-5656 AE Eindhoven, Netherlands

[2] Natl Semicond Corp, Portland, ME 04106 USA

来源：

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2009年 / 57卷 / 06期

关键词：

Integrated circuits (ICs); on-chip interconnect transmission lines; on-wafer microwave measurements; lumped-element modeling; CONDUCTORS; CIRCUITS;

D O I：

10.1109/TMTT.2009.2020780

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, we report a systematic and efficient approach to obtain lumped-element models for differential integrated-circuit interconnect transmission lines covering both the low-frequency R/C as well as the high-frequency quasi-TEM behavior. To accurately model signal delay and loss, and to preserve causality, the frequency dependence of both line resistance as well as the line inductance is included in our model. The impact of ground inductance is also properly covered by the model. The validity of our approach is verified against experimental data collected up to 120 GHz for the even and odd modes on these differential transmission lines. We predict that these lines can transport data over 1-cm distance with rates up to 40 Gb/s, even with some imbalance in differential drive.

引用

页码：1572 / 1580

页数：9

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