Analysis of the correlation between acoustic noise and vibration generated by a multi-layer ceramic capacitor

被引：37

作者：

Ko, Byung-Han ^{[1
]}

Jeong, Sang-Geuk ^{[1
]}

Ahn, Young-Ghyu ^{[2
]}

Park, Kyoung-Su ^{[3
]}

Park, No-Cheol ^{[1
]}

Park, Young-Pil ^{[1
]}

机构：

[1] Yonsei Univ, Dept Mech Engn, Seoul 120749, South Korea

[2] Samsung Electromech Co Ltd, LCR Div, Suwon, South Korea

[3] Gachon Univ, Dept Mech Engn, Songnam, Gyeonggi Do, South Korea

来源：

MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS | 2014年 / 20卷 / 8-9期

关键词：

Root Mean Square; Solder Joint; Circuit Board; Sound Pressure Level; Vibration Response;

D O I：

10.1007/s00542-014-2209-5

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Acoustic noise generated by a multi-layer ceramic capacitor (MLCC) makes users uncomfortable, so the problem must be analyzed to reduce the noise. There is a correlation between the acoustic noise and the vibration of MLCCs and the circuit board. Therefore, the acoustic noise problem must be investigated from a vibration perspective. In this study, the acoustic noise-generating mechanism was investigated, and the relationship between the characteristics of the noise and the dynamic characteristics of the circuit board with MLCC was analyzed. And a correlation criterion was proposed to predict the acoustic noise using the vibration response of the circuit board.

引用

页码：1671 / 1677

页数：7