Surface nanotextures on aluminium

被引:17
作者
Caicedo-Martinez, CE
Koroleva, EV
Thompson, GE
Skeldon, P
Shimizu, K
Habazaki, H
Hoellrigl, G
机构
[1] Univ Manchester, Inst Sci & Technol, Corros & Protect Ctr, Manchester M60 1QD, Lancs, England
[2] Keio Univ, Univ Chem Lab, Yokohama, Kanagawa 223, Japan
[3] Hokkaido Univ, Grad Sch Engn, Kita Ku, Sapporo, Hokkaido 0608628, Japan
[4] ALCAN Technol & Management Ctr Neuhausen, CH-8212 Neuhausen, Switzerland
关键词
chemical polishing; electropolishing; texture; segregation; aluminium; aluminium alloys;
D O I
10.1002/sia.1327
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Chemical polishing and electropolishing of aluminium result in fine cellular textures of nanometre dimensions, which play a role in the electrochemical behaviour of aluminium and its response to further treatment processes such as conversion coating and anodizing. Concerning the latter, the surface texture is highlighted by porous anodic film growth for protection of the substrate. The influence of residual impurities and low additions of alloying elements on the development of the textures is investigated here for superpure aluminium (99.99%) and an Al-0.4wt.%Mn alloy, respectively. Complementary analytical approaches, including atomic force microscopy and transmission electron microscopy, disclose scalloped cellular textures comprising adjacent peaks and troughs, with a dependence on the grain orientation of the aluminium substrate. In addition to texture development, enrichment of copper impurity in the alloy occurs adjacent to the alloy/oxide film interface, as revealed by in-depth elemental profiles generated by r.f. glow discharge optical emission spectroscopy. The absence of similar enrichments of iron and silicon in the alloy suggests that these elements are distributed mainly as fine segregates in the aluminium, unlike copper, which is in solid solution. At low alloying levels, manganese reveals limited enrichment and is also probably present mainly as segregates. The origin of the textures and their dependence on grain orientation are thus considered to be related to the presence and location of relatively high-melting-point elemental impurities in the alloy and their local electrochemical responses relative to the adjacent alloy surface. Copyright (C) 2002 John Wiley Sons, Ltd.
引用
收藏
页码:405 / 408
页数:4
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