Microscopic mechanism of void coalescence under shock loading

被引：12

作者：

Deng Xiao-Liang ^{[1
]}

Zhu Wen-Jun ^{[1
,2
]}

Song Zhen-Fei ^{[1
]}

He Hong-Liang ^{[1
]}

Jing Fu-Qian ^{[1
,2
]}

机构：

[1] CAEP, Inst Fluid Phys, Natl Key Lab Shock Wave & Detonat Phys, Mianyang 621900, Peoples R China

[2] Sichuan Univ, Dept Phys, Chengdu 610064, Peoples R China

来源：

ACTA PHYSICA SINICA | 2009年 / 58卷 / 07期

关键词：

nano-void; molecular dynamics; shock loading; coalescence; SINGLE-CRYSTAL COPPER; MOLECULAR-DYNAMICS; GROWTH; ORIENTATION; BEHAVIOR; DUCTILE;

D O I：

10.7498/aps.58.4772

中图分类号：

O4 [物理学];

学科分类号：

0702 ;

摘要：

The influence of void configuration on void coalescence in single crystal copper under shock loading along [100] direction has been investigated with molecular dynamics (MD) simulation. The results reveal that the voids collapse and grow by means of emission of shear dislocation loops. In the tension stage, the voids first grow independently, then the plastic zone around the voids begin to interact and overlap, leading to the void coalescence. The pattern of void coalescence observed in our simulations coincides with the microscopic experimental results. We calculated for four different configurations, characterized by the angle (theta) formed by shock direction and the line connecting the two centers of voids, and found that among the four configurations, the coalescence of the voids prefers to occur where theta is 60 degrees. Based on the resolved shear stress model around the void, we can clearly explain the simulation results.

引用

页码：4772 / 4778

页数：7

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