Tailoring dielectric properties of cordierite-mullite ceramics through Ceramic Injection Moulding

被引：12

作者：

Fuertes, V ^{[1
,2
]}

Berges, C. ^{[3
]}

Gallego, A. ^{[3
]}

Enriquez, E. ^{[2
]}

Herranz, G. ^{[3
]}

Fernandez, J. F. ^{[2
]}

机构：

[1] Univ Laval, Ctr Opt Photon & Laser, 2375 Rue Terrasse, Quebec City, PQ G1V 0A6, Canada

[2] CSIC, Dept Electroceram, Inst Ceram & Vidrio, Kelsen 5, Madrid 28049, Spain

[3] Univ Castilla La Mancha, ETSII INEI, Avda Camilo Jose Cela S-N, Ciudad Real 13071, Spain

来源：

MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS | 2020年 / 262卷

关键词：

Cordierite; Mullite; Ceramic Injection Moulding; Dielectric properties; Thermal expansion coefficient; Conventional ceramic process; GLASS-CERAMICS; ELECTRICAL-PROPERTIES; IMPEDANCE; CONSTANT; CRYSTALLIZATION; BEHAVIOR; POROSITY; PHASE;

D O I：

10.1016/j.mseb.2020.114783

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Cordierite-mullite ceramics have been processed by Ceramic Injection Moulding (CIM) for the first time. The comparison with cordierite-mullite ceramics obtained by conventional ceramic process (CP) proves the effect of processing on the structure, microstructure, thermal and dielectric properties. CIM processing favours formation of larger content of mullite phase, a more homogeneous microstructure and reduced porosity than by conven-tional processed ceramics. These factors strongly condition the dielectric behaviour, which is analyzed by complex impedance formalism up to 850 degrees C and 1 MHz. The conduction mechanism is thermally activated and the activation energy is similar to 2.5 times larger in CP than in CIM ceramics. Thermal expansion coefficient is tuned by processing method, ranging from 3.9.10(-6) degrees C-1 to 4.6.10(-6) degrees C-1. All these findings show the strong influence of processing in cordierite-mullite ceramic composites. This work shows that tailoring composition and CIM parameters allow cordierite-mullite composites to precisely fulfill the requirements for future electronic applications.

引用

页数：11

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