Preparation and thermal properties of the graphene-polyolefin adhesive composites: Application in thermal interface materials

被引：35
作者：
Cui, Tengfei [1 ]
Li, Qiang [1 ]
Xuan, Yimin [1 ,2 ]
Zhang, Ping [1 ]
机构：
[1] Nanjing Univ Sci & Technol, Sch Energy & Power Engn, Nanjing, Peoples R China
[2] Nanjing Univ Aeronaut & Astronaut, Sch Energy & Power, Nanjing, Peoples R China
来源：
MICROELECTRONICS RELIABILITY | 2015年 / 55卷 / 12期
基金：
中国国家自然科学基金;
关键词：
Thermal contact resistance; Thermal interface material; Graphene; HMPSA; GRAPHITE NANOPLATELET; CONDUCTIVITY; NANOCOMPOSITES; NANOSHEETS; FILLER;
D O I：
10.1016/j.microrel.2015.07.036
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Graphene mixed with epoxy for thermal interface material (TIM) has been well researched. However, some issues emerge when epoxy is used as matrix material, such as overflow problem, non-uniform thickness, needing solidification time, etc. In order to avoid the above issues, a new high performance phase change material (PCM) is prepared by incorporating graphene with polyolefin hot melt pressure sensitive adhesive (HMPSA). The thermal conductivity and hardness of graphene/HMPSA (GHMPSA) composites are both measured and found to be increased with the increase of filled graphene. Due to the increasing hardness, the smallest thermal contact resistance is achieved with 6 wt.% graphene, not 10 wa, even the biggest thermal conductivity of GHMPSA is 5.6 W/(mK) with 10 wt.% graphene. The comparison between the present GHMPSA TIM and other commercial TIMs indicates that the present GHMPSA composite is a commendable TIM in reducing thermal contact resistance. (C) 2015 Elsevier Ltd. All rights reserved.
引用
收藏
页码：2569 / 2574
页数：6
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