Low temperature hydrogen plasma-assisted atomic layer deposition of copper studied using in situ infrared reflection absorption spectroscopy

Atomic layer deposition (ALD) is an ideal technique to deposit ultrathin, conformal, and continuous metal thin films. However, compared to the ALD of binary materials such as metal oxides and metal nitrides, the surface reaction mechanisms during metal ALD are not well understood. In this study, the authors have designed and implemented an in situ reflection-absorption infrared spectroscopy (IRAS) setup to study the surface reactions during the ALD of Cu on Al2O3 using Cu hexafluoroacetylacetonate [Cu(hfac)(2)] and a remote H-2 plasma. Our infrared data show that complete ligand-exchange reactions occur at a substrate temperature of 80 degrees C in the absence of surface hydroxyl groups. Based on infrared data and previous studies, the authors propose that Cu(hfac)(2) dissociatively chemisorbs on the Al2O3 surface, where the Al-O-Al bridge acts as the surface reactive site, leading to surface O-Cu-hfac and O-Al-hfac species. Surface saturation during the Cu(hfac)(2) half-cycle occurs through blocking of the available chemisorption sites. In the next half-reaction cycle, H radicals from an H-2 plasma completely remove these surface hfac ligands. Through this study, the authors have demonstrated the capability of in situ IRAS as a tool to study surface reactions during ALD of metals. While transmission and internal reflection infrared spectroscopy are limited to the first few ALD cycles, IRAS can be used to probe all stages of metal ALD starting from initial nucleation to the formation of a continuous film. (C) 2014 American Vacuum Society.