Comparison of stress measurement techniques in surface micromachining

被引：36

作者：

Elbrecht, L

Storm, U

Catanescu, R

Binder, J

机构：

[1] Inst. Microsensors, Actuators, Syst., University of Bremen, D28334 Bremen

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 1997年 / 7卷 / 03期

关键词：

D O I：

10.1088/0960-1317/7/3/019

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Stress measurement techniques using micromachined structures are compared with the wafer curvature technique. Buckling bridges and rotating indicator structures are simulated, designed and fabricated using thin polysilicon films. Stress ranging from the high compressive to the high tensile state can be detected using appropriate indicator designs.

引用

页码：151 / 154

页数：4

共 10 条

[1]

ELBRECHT L, 1997, IN PRESS SENS ACTU A

[2]

Ericson F., 1995, 8th International Conference on Solid-State Sensors and Actuators and Eurosensors IX. Digest of Technical Papers (IEEE Cat. No.95TH8173), P84

[3] POST BUCKLING OF MICROMACHINED BEAMS [J].