Effect of SnO2 reinforcement on creep property of Sn-Ag-Cu solders

被引：11
作者：
Wattanakornphaiboon, Anattiya [1 ]
Canyook, Rungsinee [1 ]
Fakpan, Kittichai [1 ]
机构：
[1] King Mongkuts Univ Technol North Bangkok, Fac Engn, Dept Mat & Prod Technol Engn, Bangkok 10800, Thailand
来源：
MATERIALS TODAY-PROCEEDINGS | 2018年 / 5卷 / 03期
关键词：
SnO2; particle; Sn-Ag-Cu solder; Composite solder; Creep behavior; INTERFACIAL INTERMETALLIC COMPOUNDS; LEAD-FREE SOLDER; COPPER SUBSTRATE; COMPOSITE SOLDER; NANO-PARTICLES; MICROSTRUCTURE; NANOPARTICLES; GROWTH;
D O I：
10.1016/j.matpr.2017.10.092
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Recently, the development of Pb-free composite solder has drawn attention due to the increasing in demand of high performance electronic devices. Therefore in present study, SnO2 particle reinforced composite Sn-Ag-Cu solders with various amounts of SnO2 particles (0 wt.%, 0.1 wt.%, 0.5 wt.% and 1.0 wt.%) were fabricated by accumulative roll-bonding process (ARB). Sn-3.0Ag-0.5Cu solder was used as a solder matrix. Microstructural characterization of the SnO2 particle reinforced composite solder was done by OM and SEM. Mechanical properties of the SnO2 particle reinforced composite solder was evaluated by using microhardness test. Creep test under tension at room temperature was also performed to determine the influence of stress on creep behavior of the SnO2 particle reinforced composite solder. The experimental results showed that the microstructure of SnO2 particle reinforced composite solder consists of elongated anisotropic grain of beta-Sn phase and eutectic phase. It was found that the addition of SnO2 particles into Sn-Ag-Cu solder could increase its microhardness. The creep resistance of SnO2 particle reinforced composite solder was superior to that of the Sn-Ag-Cu solder. Moreover, power law creep model was successfully used to describe the creep behavior of SnO2 particle reinforced composite solder. (c) 2017 Elsevier Ltd. All rights reserved.
引用
收藏
页码：9213 / 9219
页数：7
相关论文
共 15 条
[1]   Effects of reflow on the interfacial characteristics between Zn nanoparticles containing Sn-3.8Ag-0.7Cu solder and copper substrate [J].
Chan, Y. H. ;
Arafat, M. M. ;
Haseeb, A. S. M. A. .
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2013, 25 (02) :91-98
[2]   Creep-Fatigue Crack Growth Behavior of Pb-Containing and Pb-Free Solders at Room and Elevated Temperatures [J].
Fakpan, Kittichai ;
Otsuka, Yuichi ;
Mutoh, Yoshiharu ;
Inoue, Shunsuke ;
Nagata, Kohsoku ;
Kodani, Kazuya .
JOURNAL OF ELECTRONIC MATERIALS, 2012, 41 (09) :2463-2469
[3]   Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads [J].
Gain, Asit Kumar ;
Chan, Y. C. ;
Yung, Winco K. C. .
MICROELECTRONICS RELIABILITY, 2011, 51 (12) :2306-2313
[4]   Creep Behavior of Lead-Free Sn-Ag-Cu plus Ni-Ge Solder Alloys [J].
Hidaka, N. ;
Watanabe, H. ;
Yoshiba, M. .
JOURNAL OF ELECTRONIC MATERIALS, 2009, 38 (05) :670-677
[5]   Microstructure of a lead-free composite solder produced by an in-situ process [J].
Hwang, SY ;
Lee, JW ;
Lee, ZH .
JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (11) :1304-1308
[6]   A review of mechanical properties of lead-free solders for electronic packaging [J].
Ma, Hongtao ;
Suhling, Jeffrey C. .
JOURNAL OF MATERIALS SCIENCE, 2009, 44 (05) :1141-1158
[7]   A review: influence of nano particles reinforced on solder alloy [J].
Noor, Ervina Efzan Mhd ;
Singh, Amares ;
Yap Tze Chuen .
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2013, 25 (04) :229-241
[8]   Ceria reinforced nanocomposite solder foils fabricated by accumulative roll bonding process [J].
Roshanghias, A. ;
Kokabi, A. H. ;
Miyashita, Y. ;
Mutoh, Y. ;
Rezayat, M. ;
Madaah-Hosseini, H. R. .
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2012, 23 (09) :1698-1704
[9]   Nanoindentation Creep Behavior of Nanocomposite Sn-Ag-Cu Solders [J].
Roshanghias, A. ;
Kokabi, A. H. ;
Miyashita, Y. ;
Mutoh, Y. ;
Ihara, I. ;
Fatt, R. G. Guan ;
Madaah-Hosseini, H. R. .
JOURNAL OF ELECTRONIC MATERIALS, 2012, 41 (08) :2057-2064
[10]   Fabrication of Sn-Ag/CeO2 Electro-Composite Solder by Pulse Electrodeposition [J].
Sharma, Ashutosh ;
Bhattacharya, Sumit ;
Das, Siddhartha ;
Das, Karabi .
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2013, 44A (12) :5587-5601
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