A new MEMS wafer probe card

被引：25

作者：

Zhang, YW

Zhang, YX

Worsham, D

Morrow, D

Marcus, RB

机构：

来源：

MEMS 97, PROCEEDINGS - IEEE THE TENTH ANNUAL INTERNATIONAL WORKSHOP ON MICRO ELECTRO MECHANICAL SYSTEMS: AN INVESTIGATION OF MICRO STRUCTURES, SENSORS, ACTUATORS, MACHINES AND ROBOTS | 1997年

关键词：

D O I：

10.1109/MEMSYS.1997.581868

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

This work presents a new type of wafer probe card consisting of an array of microcantilevers actuated by bimorph heating to make contact with the contact pads on a device chip during wafer-stage testing. The microcantilevers are meant to be operated either in air or in vacuum, Bending action is created through Joule heating of a bimorph film element on the cantilever. The deflection efficiency d delta/dP ranges from 5.8 to 9.6 mu m/mW (depending on lever parameters), the force efficiency dF/dP ranges from 1.4 to 5.5 mu N/mW; maximum controllable (reversible) deflection is in the range of 150 mu m, and contact resistance to a gold pad is approximately 1 Omega.

引用

页码：395 / 399

页数：5