Fabrication of micron scale metallic structures on photo paper substrates by low temperature photolithography for device applications

被引:4
作者
Cooke, M. D. [1 ]
Wood, D. [1 ]
机构
[1] Univ Durham, Sch Engn & Comp Sci, Durham DH1 3LE, England
关键词
paper; flexible; photolithography; microelectronics; NANOPARTICLE;
D O I
10.1088/0960-1317/25/11/115017
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Using commercial standard paper as a substrate has a significant cost reduction implication over other more expensive substrate materials by approximately a factor of 100 (Shenton et al 2015 EMRS Spring Meeting; Zheng et al 2013 Nat. Sci. Rep. 3 1786). Discussed here is a novel process which allows photolithography and etching of simple metal films deposited on paper substrates, but requires no additional facilities to achieve it. This allows a significant reduction in feature size down to the micron scale over devices made using more conventional printing solutions which are of the order of tens of microns. The technique has great potential for making cheap disposable devices with additional functionality, which could include flexibility and foldability, simple disposability, porosity and low weight requirements. The potential for commercial applications and scale up is also discussed.
引用
收藏
页数:9
相关论文
共 30 条
[1]  
Andersson P, 2002, ADV MATER, V14, P1460, DOI 10.1002/1521-4095(20021016)14:20<1460::AID-ADMA1460>3.0.CO
[2]  
2-S
[3]  
Bollstrom R, 2012, PAPERCON NEW ORLEANS
[4]  
Cooke M D, 2010, P SPIE ORGANIC FIELD, VIX
[5]   Thin single layer materials for device application [J].
Cooke, MD ;
Allwood, DA ;
Atkinson, D ;
Xiong, G ;
Faulkner, CC ;
Cowburn, RP .
JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 2003, 257 (2-3) :387-396
[6]  
Demkov A, 2005, MAT FUNDAMENTALS GAT, P48
[7]   Method for controlling surface energies of paper substrates to create paper-based printed electronics [J].
Dogome, Kazutomo ;
Enomae, Toshiharu ;
Isogai, Akira .
CHEMICAL ENGINEERING AND PROCESSING-PROCESS INTENSIFICATION, 2013, 68 :21-25
[8]  
Flexible Display Substrate Technology, 2013, IHS EM TECHN REP
[9]   Direct ink-jet printing of Ag-Cu nanoparticle and Ag-precursor based electrodes for OFET applications [J].
Gamerith, Stefan ;
Klug, Andreas ;
Scheiber, Horst ;
Scherf, Ullrich ;
Moderegger, Erik ;
List, Emit J. W. .
ADVANCED FUNCTIONAL MATERIALS, 2007, 17 (16) :3111-3118
[10]   Impact of adhesive rheology on stress-distortion of bonded plastic substrates for flexible electronics applications [J].
Haq, Jesmin ;
Vogt, Bryan D. ;
Raupp, Gregory B. ;
Loy, Doug .
MICROELECTRONIC ENGINEERING, 2011, 88 (09) :2852-2856