Investigation on 3-D-Printing Technologies for Millimeter-Wave and Terahertz Applications

被引:153
作者
Zhang, Bing [1 ]
Guo, Yong-Xin [1 ]
Zirath, Herbert [2 ,3 ]
Zhang, Yue Ping [4 ]
机构
[1] Natl Univ Singapore, Dept Elect & Comp Engn, Singapore 117576, Singapore
[2] Chalmers Univ Technol, Dept Microtechnol & Nanosci MC2, MEL, SE-41296 Gothenburg, Sweden
[3] Ericsson AB, Ericsson Res, SE-41756 Gothenburg, Sweden
[4] Nanyang Technol Univ, Sch Elect & Elect Engn, Singapore 639798, Singapore
基金
瑞典研究理事会;
关键词
Millimeter wave (mmWave); terahertz (THz); 3-D printing; BAND; STEREOLITHOGRAPHY; INTEGRATION; ANTENNAS; GUIDES;
D O I
10.1109/JPROC.2016.2639520
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Three-dimensional-printing technologies have been receiving great attention for a wide variety of applications in recent years for cost effectiveness, eco-friendliness, and process simplicity in complicated structures. This paper describes the-challenges and solutions of applying 3-D-printing technologies in fabricating passive millimeter-wave (mmWave) and terahertz (THz) devices. First, we review the state-of-the-art dielectric 3-D-printed passive mmWave and THz devices. Then, we focus on our novel 3-D-printed metallic passive mmWave and THz devices such as horn antennas and waveguides. Next, we analyze the dimensional tolerance and surface roughness of various 3-D-printing technologies in order to provide a guide for choosing an appropriate technology for specific applications. Finally, we summarize the current work and identify the future studies in material powder refinement, surface treatment, optimization of the print process, development of hybrid dielectric and metallic 3-D-printing technology for realizing not only simple mmWave and THz devices but also sophisticated mmWave and THz systems.
引用
收藏
页码:723 / 736
页数:14
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