An ultraviolet-curable mold for sub-100-nm lithography

被引：278

作者：

Choi, SJ

Yoo, PJ

Baek, SJ

Kim, TW

Lee, HH

机构：

[1] Minuta Tech, Ctr Biotechnol Incubating, Seoul 151742, South Korea

[2] Seoul Natl Univ, Sch Chem Engn, Seoul 151744, South Korea

来源：

JOURNAL OF THE AMERICAN CHEMICAL SOCIETY | 2004年 / 126卷 / 25期

关键词：

D O I：

10.1021/ja048972k

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

We describe a novel UV-curable mold that is stiff enough for replicating dense sub-100-nm features even with a high aspect ratio. It also allows for flexibility when the mold is prepared on a flexible support such that large area replication can be accomplished. The composite material of the mold is inert to chemicals and solvents. The surface energy is made low with a small amount of releasing agent such that the mold can be removed easily and cleanly after patterning. In addition, the material allows self-replication of the mold. These unique features of the mold material should make the mold quite useful for various patterning purposes. Copyright © 2004 American Chemical Society.

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页码：7744 / 7745

页数：2

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