Liquid-phase epitaxial growth of heavily doped Al p-type contact layers for SiC devices and resulting ohmic contacts

被引:13
|
作者
Syrkin, A [1 ]
Dmitriev, V
Kovalenkov, O
Bauman, D
Crofton, J
机构
[1] Technol & Devices Int Inc, Gaithersburg, MD 20877 USA
[2] Crystal Growth Res Ctr, RU-194021 St Petersburg, Russia
[3] Murray State Univ, Murray, KY 42701 USA
来源
SILICON CARBIDE AND RELATED MATERIALS 2001, PTS 1 AND 2, PROCEEDINGS | 2002年 / 389-3卷
关键词
liquid-phase epitaxy; ohmic contacts; silicon carbide devices;
D O I
10.4028/www.scientific.net/MSF.389-393.291
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this paper we report on ohmic contacts to p-type silicon carbide with record low specific contact resistance. The contacts were formed to p(+)-SiC layers with high Al concentration grown by liquid phase epitaxy (LPE) on 2 inch 6H and 4H-SiC samples. Al atomic concentration in LPE grown layers exceeded 1x10(20) cm(-3). Ti-Al ohmic contacts with contact resistivity in 10(-6) Omegaxcm(2) range were fabricated to both p-6H-SiC and p-4H-SiC materials in reproducible manner. Developed LPE technology may substitute ion implantation technique for p(+)-contact layer formation for power SiC devices.
引用
收藏
页码:291 / 294
页数:4
相关论文
共 50 条
  • [11] Ni/Au ohmic contacts to p-type Mg-doped CuCrO2 epitaxial layers
    Lim, W. T.
    Stafford, L.
    Sadik, P. W.
    Norton, D. P.
    Pearton, S. J.
    Wang, Y. L.
    Ren, F.
    APPLIED PHYSICS LETTERS, 2007, 90 (14)
  • [12] Comparison of Pt-based ohmic contacts with Ti-Al ohmic contacts for p-type SiC
    Mohammad, FA
    Cao, Y
    Chang, KC
    Porter, LM
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2005, 44 (08): : 5933 - 5938
  • [13] Morphological study of the Al-Ti ohmic contact to p-type SiC
    Mohney, SE
    Hull, BA
    Lin, JY
    Crofton, J
    SOLID-STATE ELECTRONICS, 2002, 46 (05) : 689 - 693
  • [14] Improved Al/Si ohmic contacts to p-type 4H-SiC
    Kakanakov, R
    Kassamakova, L
    Kassamakov, I
    Zekentes, K
    Kuznetsov, N
    MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 2001, 80 (1-3): : 374 - 377
  • [15] Ti/Al/Au OHMIC CONTACTS TO p-TYPE 4H-SiC
    Han, Chao
    Zhang, Yuming
    Song, Qingwen
    Zhang, Yimen
    Tang, Xiaoyan
    Guo, Hui
    2014 12TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT), 2014,
  • [16] Ni-Al ohmic contact to p-type 4H-SiC
    Vang, H.
    Lazar, M.
    Brosselard, P.
    Raynaud, C.
    Cremillieu, P.
    Leclercq, J. -L.
    Bluet, J. -M.
    Scharnholz, S.
    Planson, D.
    SUPERLATTICES AND MICROSTRUCTURES, 2006, 40 (4-6) : 626 - 631
  • [17] Ti/Al/W Ohmic contacts to p-type implanted 4H-SiC
    Vivona, M.
    Greco, G.
    Lo Nigro, R.
    Bongiorno, C.
    Roccaforte, F.
    JOURNAL OF APPLIED PHYSICS, 2015, 118 (03)
  • [18] Nanolayered Au/Ti/Al ohmic contacts to p-type SiC: Electrical, morphological and chemical properties depending on the contact composition
    Kolaklieva, L.
    Kakanakov, R.
    Avramova, I.
    Marinova, Ts.
    SILICON CARBIDE AND RELATED MATERIALS 2006, 2007, 556-557 : 725 - +
  • [19] P-type SiC layers formed by VLS induced selective epitaxial growth
    Lazar, M
    Jacquier, C
    Dubois, C
    Raynaud, C
    Ferro, G
    Planson, D
    Brosselard, P
    Monteil, Y
    Chante, JP
    SILICON CARBIDE AND RELATED MATERIALS 2004, 2005, 483 : 633 - 636
  • [20] Microstructure and transport properties in alloyed Ohmic contacts to p-type SiC and GaN for power devices applications
    Roccaforte, F.
    Frazzetto, A.
    Greco, G.
    Lo Nigro, R.
    Giannazzo, F.
    Leszczynski, M.
    Pristawko, P.
    Zanetti, E.
    Saggio, M.
    Raineri, V.
    HETEROSIC & WASMPE 2011, 2012, 711 : 203 - +