Mathematical modeling of electrodeposition of permalloy thin film II. Pulsed current plating

被引：2

作者：

Doo, SK ^{[1
]}

Sohn, HJ

Kang, T

机构：

[1] Samsung Adv Inst Technol, Electrochem Lab, Suwon 440600, South Korea

[2] Seoul Natl Univ, Sch Mat Sci & Engn, Kwanak Ku, Seoul 151742, South Korea

来源：

METALS AND MATERIALS-KOREA | 1999年 / 5卷 / 05期

关键词：

modeling; electrodeposition; permalloy; pulsed current;

D O I：

10.1007/BF03026159

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A mathematical model presented for direct current: plating is extended to describe the electrodeposition of permalloy under pulsed current plating conditions. The agreement between the calculated and experimental values is excellent. The content of iron in permalloy thin film under the pulsed current condition is higher than under direct current plating at the same average current density, which is explained in terms of various plating parameters from simulated results.

引用

页码：459 / 463

页数：5