Conductance interference effects in an electron-beam-resist-free chemical vapor deposition graphene device sandwiched between two h-BN sheets

We report fabrication and measurements of hexagonal boron nitride (h-BN)/chemical vapor deposition (CVD) graphene/h-BN heterostructure devices without using expensive, time-consuming electron-beam lithography and toxic carbon tetrafluoride or sulfur tetrafluoride etching. We use efficient transfer of h-BN/CVD graphene by polypropylene carbonate onto a pre-prepared metal contacts/h-BN/SiO2 substrate. In this case, CVD-graphene is suspended from the h-BN substrate which allows efficient gas annealing process for improving the device mobility. Interestingly, we find that the top h-BN capping layer could enhance the carrier interference effect in CVD graphene, a great advantage for low-cost graphene-based interference-type electronic devices. (C) 2019 Elsevier Ltd. All rights reserved.