Twin-induced ultra-high thermal conductivity of sintering Ag nanoparticles for high power density electronic packaging

被引：0

作者：

Wang, Shuai ^{[1
]}

Li, Mingyu ^{[1
]}

Kim, Jongmyung ^{[2
]}

机构：

[1] Harbin Inst Technol, Shenzhen Grad Sch, Shenzhen Key Lab Adv Mat, Shenzhen, Peoples R China

[2] Jeonnam Prov Coll, Jeonnam, South Korea

来源：

2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2014年

关键词：

Ag nanoparticle; sintering; bonding; thermal conductivity; twinning; DEPENDENCE;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Rapid pressureless low temperature sintering of Ag nanoparticles for bonding is achieved. Organic shells adsorbing on the surface of Ag nanoparticles to stabilize them are thinned to be a sparse protecting layer. Numerous coherent twin boundaries formed in sintered Ag nanoparticles with a grain size of 21 nm induce ultra- high thermal conductivity (229 W/m.K), which overcomes the intrinsic defect that metals with nano-sized grain generally cause a pronounced decrease in thermal conductivity because of the grain boundary scattering effect.

引用

页码：163 / 166

页数：4

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