Preparation, morphology and thermal/mechanical properties of epoxy/nanoclay composite

被引:184
作者
Wang, Lei
Wang, Ke
Chen, Ling
Zhang, Yongwei
He, Chaobin
机构
[1] Inst Mat Res & Engn, Mol & Performance Mat Cluster, Singapore 117602, Singapore
[2] Natl Univ Singapore, Dept Mat Sci, Singapore 117543, Singapore
关键词
nano-structures; fracture toughness; surface treatments;
D O I
10.1016/j.compositesa.2005.12.020
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A novel approach assisted with solvent was developed to disperse clay into epoxy matrix. The dispersion of clay was examined by means of optical microscopy (OM), wide angle X-ray scattering (WAXS) and transmission electron microscopy (TEM). Batches of cured samples containing 1-3 wt.% silane-modified clay (SMC) were prepared and their thermal/mechanical properties were studied by dynamic mechanical analysis (DMA), tensile and fracture tests. Improvements on storage modulus, Young's modulus and fracture toughness were achieved with incorporation of SMC clay. The fracture surfaces of the nanocomposites were imaged by scanning electron microscopy (SEM) to investigate the toughening mechanisms. (c) 2006 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1890 / 1896
页数:7
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