Stable resistive switching characteristics of ZrO2-based memory device with low-cost

被引:19
作者
Fu, Liping [1 ]
Li, Yingtao [2 ,4 ]
Han, Genliang [3 ]
Gao, Xiaoping [3 ]
Chen, Chuanbing [2 ]
Yuan, Peng [2 ]
机构
[1] Lanzhou Univ, Cuiying Honors Coll, Lanzhou 730000, Peoples R China
[2] Lanzhou Univ, Sch Phys Sci & Technol, Lanzhou 730000, Peoples R China
[3] Gansu Acad Sci, Inst Sensor Technol, Lanzhou 730000, Peoples R China
[4] Lanzhou Univ, Minist Educ, Key Lab Special Funct Mat & Struct Design, Lanzhou 730000, Peoples R China
基金
中国国家自然科学基金;
关键词
RRAM; ZrO2; Resistive switching; Low-cost; NONVOLATILE MEMORY; FILMS; ZRO2;
D O I
10.1016/j.mee.2017.02.019
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The stabilization of the resistive switching characteristics at both room temperature (RT) and 85 degrees C of the ZrO2-based resistive random access memory were investigated for nonvolatile memory applications. In both conditions, the sandwiched aluminum top electrode/ZrO2 thin films with embedded copper layer/aluminum bottom electrode structure devices exhibited reproducible bipolar resistive switching behavior and reliable data retention (little degradation over 10(5) and 10(4) sat RT and 85 degrees C, respectively). For the fabricated device, both the bottom electrode and top electrode materials are fabricated from Al with reduced material cost. Furthermore, the ZrO2 and embedded Cu materials also show good compatibility with the current CMOS technology to further reduce cost. The conduction mechanism of the low resistance state (LRS) is dominated by ohmic conduction, whereas the high resistance state (HRS) conduction is dominated by space charge limited conduction (SCLC). Our study shows that the memory device with high uniformity and good stabilization at both RT and 85 degrees C is a promising candidate for low-cost nonvolatile memory device applications. (C) 2017 Elsevier B.V. All rights reserved.
引用
收藏
页码:26 / 29
页数:4
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