Pulsed electric current sintering of Cu matrix composites reinforced with plain and coated alumina powders

被引:27
作者
Leon, Carlos A. [1 ]
Rodriguez-Ortiz, Gabriel [1 ]
Nanko, Makoto [2 ]
Aguilar, Ena A. [1 ]
机构
[1] Univ Michoacana, Inst Invest Met, Morelia 58000, Mich, Mexico
[2] Nagaoka Univ Technol, Dept Mech Engn, Nagaoka, Niigata 9402188, Japan
关键词
Pulsed electric current sintering; Metal-matrix composites (MMCs); Particle-reinforcement; Sintering; Densification behavior; SICP/AL COMPOSITES; COPPER; DENSIFICATION; FABRICATION; BEHAVIOR;
D O I
10.1016/j.powtec.2013.10.025
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
Cu/Al2O3 composites with Al2O3 fractions between 0.3 and 0.6 were sintered at 100 MPa under vacuum by pulse electric current sintering (PECS). The effect of the temperature and the ceramic content on the microstructure and densification of the composites was studied. The sintering behavior of mixtures prepared by the conventional blending of alumina and copper powders was compared with that of mixtures of copper with Cu-coated Al2O3 particles (18 vol.% Cu). The composites prepared by the coated filler method were slightly more densified than those made through the admixture method, a variation that became more pronounced with an increase in the ceramic content. The composites prepared by the admixture method showed a large number of Al2O3-Al2O3 contacts that prevented densification, forming interparticle pores. The coated filler materials enhanced the connectivity of the matrix and distribution of alumina, yielding Cu/Al2O3 composites with 98.5 to 96.7% densification when varying the ceramic content from 30 to 60 vol.%, respectively. (C) 2013 Elsevier B.V. All rights reserved.
引用
收藏
页码:1 / 7
页数:7
相关论文
共 21 条
[1]   Superfast densification of nanocrystalline oxide powders by spark plasma sintering [J].
Chaim, R. .
JOURNAL OF MATERIALS SCIENCE, 2006, 41 (23) :7862-7871
[2]  
Chung: D.D.L., 1995, Materials for Electronic Packaging
[3]   High volume fraction SiCp/Al composites prepared by pressureless melt infiltration: Processing, properties and applications [J].
Cui, Y .
COMPOSITE MATERIALS III, 2003, 249 :45-48
[4]   Mechanical and tribological behavior of nanostructured copper-alumina cermets obtained by Pulsed Electric Current Sintering [J].
Eddine, Wassim Zein ;
Matteazzi, Paolo ;
Celis, Jean-Pierre .
WEAR, 2013, 297 (1-2) :762-773
[5]   Properties and spot welding behaviour of copper-alumina composites through ball milling and mechanical alloying [J].
Hussain, Zuhailawati ;
Kit, Leong Chee .
MATERIALS & DESIGN, 2008, 29 (07) :1311-1315
[6]  
Kang S.-J.L., 2004, SINTERING DENSIFICAT
[7]   Effects of heating rate on microstructure and transparency of spark-plasma-sintered alumina [J].
Kim, Byung-Nam ;
Hiraga, Keijiro ;
Morita, Koji ;
Yoshida, Hidehiro .
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2009, 29 (02) :323-327
[8]   Al2O3 particle rounding in molten copper and Cu8wt%Al [J].
Krueger, C. ;
Mortensen, A. .
JOURNAL OF MATERIALS SCIENCE, 2012, 47 (17) :6346-6353
[9]   Cold compaction of metal-ceramic powders in the preparation of copper base hybrid materials [J].
Leon, C. A. ;
Rodriguez-Ortiz, G. ;
Aguilar-Reyes, E. A. .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2009, 526 (1-2) :106-112
[10]   Fabrication of nano-Al2O3/Cu composite with powder treated by spherical process [J].
Liu Xiang-bing ;
Jia Cheng-chang ;
Chen Xiao-hua ;
Gai Guo-sheng .
JOURNAL OF IRON AND STEEL RESEARCH INTERNATIONAL, 2007, 14 :94-98