Numerical simulation of plasma dynamics in laser shock processing experiments

被引:44
|
作者
Morales, M. [1 ]
Porro, J. A. [1 ]
Blasco, M. [1 ]
Molpeceres, C. [1 ]
Ocana, J. L. [1 ]
机构
[1] Univ Politecn Madrid, Ctr Laser UPM, Madrid 28031, Spain
关键词
Plasma; Laser shock processing; Surface treatment; Shock waves; Residual stress; Numerical modelling; SURFACE DEFORMATION; RESIDUAL-STRESSES; IMPROVEMENT; FIELDS; MODEL;
D O I
10.1016/j.apsusc.2008.09.067
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Laser shock processing (LSP) is based on the application of a high intensity pulsed laser beam (I > 1 GW/cm(2); tau < 50 ns) at the interface between the metallic target and the surrounding medium (a transparent con. ning material, normally water) forcing a sudden vaporization of the metallic surface into a high temperature and density plasma that immediately develops inducing a shock wave propagating into the material. The shock wave induces plastic deformation and a residual stress distribution in the target material. Laser shock processing is being considered as a competitive alternative technology to classical treatments for improving fatigue, corrosion cracking and wear resistance of metallic materials. The description of the relevant laser absorption phenomena becomes hardly complicated because of the non-linear effects appearing along the interaction process and which significantly alter the shocking dynamics. A simulation model (SHOCKLAS), dealing with the main aspects of LSP modelling in a coupled way, has been developed by the authors. In this paper the study will be centred on the simulation of the hydrodynamic phenomenology arising from plasma expansion between the confinement layer and the base material using HELIOS (1-D radiation-hydrodynamics lagrangean fluiddynamic code). This code is used to study plasma dynamics under laser shock processing conditions. The influence of the con. ning layer (medium and thickness) on plasma pressure is also studied. (C) 2008 Elsevier B.V. All rights reserved.
引用
收藏
页码:5181 / 5185
页数:5
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